M38510/20302SEA by: NXP Semiconductors

IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM

Part Details for M38510/20302SEA by NXP Semiconductors

Overview of M38510/20302SEA by NXP Semiconductors

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Applications Aerospace and Defense Transportation and Logistics Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

Part Details for M38510/20302SEA

M38510/20302SEA CAD Models

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M38510/20302SEA Part Data Attributes

M38510/20302SEA NXP Semiconductors
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M38510/20302SEA NXP Semiconductors IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP,
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 250 ns
JESD-30 Code R-XDIP-T16
JESD-609 Code e3/e4
Memory Density 65536 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 256 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.13 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade MILITARY
Terminal Finish TIN/NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M38510/20302SEA

This table gives cross-reference parts and alternative options found for M38510/20302SEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/20302SEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M38510/20302BEA IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20302BEA
TBP24S10MJ 256X4 OTPROM, 75ns, CDIP16, CERAMIC, DIP-16 Texas Instruments M38510/20302SEA vs TBP24S10MJ
M38510/20301BEA OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Teledyne e2v M38510/20302SEA vs M38510/20301BEA
M38510/20301BEA OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc M38510/20302SEA vs M38510/20301BEA
M38510/20301BEA IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20301BEA
M38510/20302BEA 256X4 OTPROM, 75ns, DIP16, 0.25 X 0.875 INCH, DIP-16 Texas Instruments M38510/20302SEA vs M38510/20302BEA
M38510/20301BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20301BEX
M38510/20302SEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20302SEX
M38510/20301BEX OTP ROM, 256X4, 75ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 Lansdale Semiconductor Inc M38510/20302SEA vs M38510/20301BEX
M38510/20302BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20302BEX
Part Number Description Manufacturer Compare
N82S129NB 256X4 OTPROM, 50ns, PDIP16 Philips Semiconductors M38510/20302SEA vs N82S129NB
M38510/20302SEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20302SEX
M38510/20301BEX IC 256 X 4 OTPROM, 75 ns, DIP16, 0.25 X 0.875 INCH, DIP-16, Programmable ROM NXP Semiconductors M38510/20302SEA vs M38510/20301BEX
DM74S287AJ 256X4 OTPROM, 30ns, CDIP16, CERAMIC, DIP-16 Texas Instruments M38510/20302SEA vs DM74S287AJ
AM27S20/BEA OTP ROM, 256X4, 60ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M38510/20302SEA vs AM27S20/BEA
N82S229F OTP ROM, 256X4, 50ns, Bipolar, CDIP16, Signetics M38510/20302SEA vs N82S229F
AM27S21APCB OTP ROM, 256X4, 30ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD M38510/20302SEA vs AM27S21APCB
AM27S21DCB OTP ROM, 256X4, 45ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD M38510/20302SEA vs AM27S21DCB
AM27S20ADCB OTP ROM, 256X4, 30ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD M38510/20302SEA vs AM27S20ADCB
N82S126N OTP ROM, 256X4, 50ns, Bipolar, PDIP16, Signetics M38510/20302SEA vs N82S126N

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