M38510/23112BWA by:

256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22

Part Details for M38510/23112BWA by Motorola Mobility LLC

Overview of M38510/23112BWA by Motorola Mobility LLC

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Applications Aerospace and Defense Automotive

Part Details for M38510/23112BWA

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M38510/23112BWA Part Data Attributes

M38510/23112BWA Motorola Mobility LLC
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M38510/23112BWA Motorola Mobility LLC 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code DIP
Package Description DIP,
Pin Count 22
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 75 ns
JESD-30 Code R-XDIP-T22
JESD-609 Code e0
Memory Density 1024 bit
Memory IC Type STANDARD SRAM
Memory Width 4
Number of Functions 1
Number of Terminals 22
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 256X4
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology TTL
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M38510/23112BWA

This table gives cross-reference parts and alternative options found for M38510/23112BWA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/23112BWA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM93L422/DMC Standard SRAM, 256X4, 75ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD M38510/23112BWA vs AM93L422/DMC
M38510/23112BWX Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 Harris Semiconductor M38510/23112BWA vs M38510/23112BWX
M38510/23112BWC Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff M38510/23112BWA vs M38510/23112BWC
Part Number Description Manufacturer Compare
MAC5101CS Standard SRAM, 256X4, 130ns, CMOS, CDIP22, Plessey Semiconductors Ltd M38510/23112BWA vs MAC5101CS
LH5101-30 Standard SRAM, 256X4, 300ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22 Sharp Corp M38510/23112BWA vs LH5101-30
AM93L422A/DMC Standard SRAM, 256X4, 55ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD M38510/23112BWA vs AM93L422A/DMC
P4C422-35PI Standard SRAM, 256X4, 35ns, CMOS, PDIP22, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWA vs P4C422-35PI
AM93412ADCB Standard SRAM, 256X4, 35ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD M38510/23112BWA vs AM93412ADCB
M38510/23112BWX Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 Harris Semiconductor M38510/23112BWA vs M38510/23112BWX
P4C422-15PM Standard SRAM, 256X4, 15ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWA vs P4C422-15PM
AM91L01APC Standard SRAM, 256X4, 500ns, MOS, PDIP22, PLASTIC, DIP-22 AMD M38510/23112BWA vs AM91L01APC
AM91L01BDM Standard SRAM, 256X4, 400ns, NMOS, CDIP22, HERMETIC SEALED, SIDE BRAZED, DIP-22 AMD M38510/23112BWA vs AM91L01BDM
CY7C122-35DC Standard SRAM, 256X4, 35ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Cypress Semiconductor M38510/23112BWA vs CY7C122-35DC

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