Datasheets
MB81F161622B-60FN by:

Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50

Part Details for MB81F161622B-60FN by FUJITSU Limited

Overview of MB81F161622B-60FN by FUJITSU Limited

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for MB81F161622B-60FN

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MB81F161622B-60FN Part Data Attributes

MB81F161622B-60FN FUJITSU Limited
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MB81F161622B-60FN FUJITSU Limited Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer FUJITSU LTD
Package Description TSOP2, TSOP50,.46,32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode DUAL BANK PAGE BURST
Access Time-Max 5.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G50
JESD-609 Code e0
Length 20.95 mm
Memory Density 16777216 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 50
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSOP50,.46,32
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified
Refresh Cycles 4096
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.0004 A
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for MB81F161622B-60FN

This table gives cross-reference parts and alternative options found for MB81F161622B-60FN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MB81F161622B-60FN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W981616CH-5 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Winbond Electronics Corp MB81F161622B-60FN vs W981616CH-5
MB81F161622B-60FN 1MX16 SYNCHRONOUS DRAM, 5.5ns, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 FUJITSU Semiconductor Limited MB81F161622B-60FN vs MB81F161622B-60FN
K4S161622D-TE60 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 X 0.825 INCH, TSOP2-50 Samsung Semiconductor MB81F161622B-60FN vs K4S161622D-TE60
VG3617161ET-6 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 Vanguard International Semiconductor Corporation MB81F161622B-60FN vs VG3617161ET-6
V54C317162VCT-6 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 Mosel Vitelic Corporation MB81F161622B-60FN vs V54C317162VCT-6
K4S161622H-TC700 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 X 0.825 INCH, 0.80 MM PITCH, TSOP2-50 Samsung Semiconductor MB81F161622B-60FN vs K4S161622H-TC700
V54C316162VCT-6 1M X 16 SYNCHRONOUS DRAM, 5.5 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 Mosel Vitelic Corporation MB81F161622B-60FN vs V54C316162VCT-6
MB81F161622C-60FN Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 FUJITSU Semiconductor Limited MB81F161622B-60FN vs MB81F161622C-60FN
V54C316162VCT6 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 Mosel Vitelic Corporation MB81F161622B-60FN vs V54C316162VCT6
IS45S16100E-7TLA2 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50 Integrated Silicon Solution Inc MB81F161622B-60FN vs IS45S16100E-7TLA2
Part Number Description Manufacturer Compare
HY57V161610BLTC-15 Synchronous DRAM, 1MX16, 9ns, CMOS, PDSO50, 0.400 X 0.825 INCH, 0.80 MM PITCH, TSOP2-50 SK Hynix Inc MB81F161622B-60FN vs HY57V161610BLTC-15
IS45S16100A1-7TLA1 Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50 Integrated Silicon Solution Inc MB81F161622B-60FN vs IS45S16100A1-7TLA1
UPD4218160LG5-A70-7JF Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 NEC Electronics Group MB81F161622B-60FN vs UPD4218160LG5-A70-7JF
UPD4216160G5-60-7JF IC,DRAM,FAST PAGE,1MX16,CMOS,TSOP,44PIN,PLASTIC Renesas Electronics Corporation MB81F161622B-60FN vs UPD4216160G5-60-7JF
MB811171622E-67FN 1M X 16 SYNCHRONOUS DRAM, 9 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 FUJITSU Semiconductor Limited MB81F161622B-60FN vs MB811171622E-67FN
UPD42S18160G5-80-7JF Fast Page DRAM, 1MX16, 80ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 NEC Electronics America Inc MB81F161622B-60FN vs UPD42S18160G5-80-7JF
K4S161622E-TC80 Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 X 0.825 INCH, 0.80 MM PITCH, TSOP2-50 Samsung Semiconductor MB81F161622B-60FN vs K4S161622E-TC80
V54C316162VCT6 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 Mosel Vitelic Corporation MB81F161622B-60FN vs V54C316162VCT6
SM2404T-7.5 Memory IC, 1MX16, CMOS, PDSO50, Ramtron International Corporation MB81F161622B-60FN vs SM2404T-7.5
W981616AH-7 Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, TSOP2-50 Winbond Electronics Corp MB81F161622B-60FN vs W981616AH-7

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