Part Details for MBM27C64-30-W by FUJITSU Semiconductor Limited
Overview of MBM27C64-30-W by FUJITSU Semiconductor Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Environmental Monitoring
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Agriculture Technology
Telecommunications
Medical Imaging
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| CLF1G0060-30 | Rochester Electronics LLC | CLF1G0060-30 - 30W Broadband RF power GaN HEMT | |
| BLF3G21-30 | Rochester Electronics LLC | BLF3G21-30 - UHF 30W Power LDMOS Transistor (Ampleon Die) | |
| POE300F-50L | Coilcraft Inc | SMPS Transformer, 30W |
Part Details for MBM27C64-30-W
MBM27C64-30-W CAD Models
MBM27C64-30-W Part Data Attributes
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MBM27C64-30-W
FUJITSU Semiconductor Limited
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Datasheet
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MBM27C64-30-W
FUJITSU Semiconductor Limited
UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Package Description | WQCCN, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| Length | 13.97 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WQCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.3 mm | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.43 mm |
Alternate Parts for MBM27C64-30-W
This table gives cross-reference parts and alternative options found for MBM27C64-30-W. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM27C64-30-W, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM2764-30 | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | MBM27C64-30-W vs MBM2764-30 |
| AM27C64-305LI | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM27C64-30-W vs AM27C64-305LI |
| MBM2764-30 | UVPROM, 8KX8, 300ns, NMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | MBM27C64-30-W vs MBM2764-30 |
| AM2764A-30LE | UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | MBM27C64-30-W vs AM2764A-30LE |
| AM27C64-300LC | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM27C64-30-W vs AM27C64-300LC |
| MBM2764-30-X | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | MBM27C64-30-W vs MBM2764-30-X |
| AM27C64-300LCB | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM27C64-30-W vs AM27C64-300LCB |
| AM27C64-305LCB | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM27C64-30-W vs AM27C64-305LCB |
| MBM27C6430ZW | UVPROM, 8KX8, 300ns, CMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | MBM27C64-30-W vs MBM27C6430ZW |
| MBM27C64-30 | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | MBM27C64-30-W vs MBM27C64-30 |