Part Details for MX25L1608DMI-12G by Macronix International Co Ltd
Overview of MX25L1608DMI-12G by Macronix International Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| CS-SASMINIHD2-002 | Amphenol Cables on Demand | Amphenol CS-SASMINIHD2-002 2m (6.6') External 4x HD Mini-SAS Cable - 4x Mini-SAS HD (SFF-8644) to 4x Mini-SAS HD (SFF-8644) Passive Copper Cable [28 AWG] - 12G SAS 3.0 / iPass+™ HD | |
| CS-SASMINIHD2-003 | Amphenol Cables on Demand | Amphenol CS-SASMINIHD2-003 3m (9.8') External 4x HD Mini-SAS Cable - 4x Mini-SAS HD (SFF-8644) to 4x Mini-SAS HD (SFF-8644) Passive Copper Cable [28 AWG] - 12G SAS 3.0 / iPass+™ HD | |
| CS-SASMINIHD2-001 | Amphenol Cables on Demand | Amphenol CS-SASMINIHD2-001 1m (3.3') External 4x HD Mini-SAS Cable - 4x Mini-SAS HD (SFF-8644) to 4x Mini-SAS HD (SFF-8644) Passive Copper Cable [30 AWG] - 12G SAS 3.0 / iPass+™ HD |
Part Details for MX25L1608DMI-12G
MX25L1608DMI-12G CAD Models
MX25L1608DMI-12G Part Data Attributes
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MX25L1608DMI-12G
Macronix International Co Ltd
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Datasheet
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MX25L1608DMI-12G
Macronix International Co Ltd
EEPROM, 8MX2, Serial, CMOS, PDSO16, 0.300 INCH, ROHS COMPLIANT, MS-013, SOP-16
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MACRONIX INTERNATIONAL CO LTD | |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP16,.4 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 86 MHz | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G16 | |
| Length | 10.3 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP16,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.65 mm | |
| Serial Bus Type | 3-WIRE | |
| Standby Current-Max | 0.00002 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 7.52 mm | |
| Write Cycle Time-Max (tWC) | 100 ms | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for MX25L1608DMI-12G
This table gives cross-reference parts and alternative options found for MX25L1608DMI-12G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX25L1608DMI-12G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MR27V1641L-XXXMP | MASK ROM, 16MX1, 14ns, CMOS, PDSO16, 0.375 INCH, 1.27 MM PITCH, PLASTIC, SOP-16 | LAPIS Semiconductor Co Ltd | MX25L1608DMI-12G vs MR27V1641L-XXXMP |
| M25P16-VMF6 | 2M X 8 FLASH 2.7V PROM, PDSO16, 0.300 INCH, SOP-16 | STMicroelectronics | MX25L1608DMI-12G vs M25P16-VMF6 |
| MX23L1654MC-20 | MASK ROM, 2MX8, CMOS, PDSO16, 0.300 INCH, MS-013, SOP-16 | Macronix International Co Ltd | MX25L1608DMI-12G vs MX23L1654MC-20 |
| M25P16-VMF6P | 2M X 8 FLASH 2.7V PROM, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 | STMicroelectronics | MX25L1608DMI-12G vs M25P16-VMF6P |
| M25P16-VMF6G | Flash, 2MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | Numonyx Memory Solutions | MX25L1608DMI-12G vs M25P16-VMF6G |
| MX23L1654MC-20G | MASK ROM, 2MX8, CMOS, PDSO16, 0.300 INCH, LEAD FREE, MS-013, SOP-16 | Macronix International Co Ltd | MX25L1608DMI-12G vs MX23L1654MC-20G |
| NX25P16-VFI-G | 16MX1 FLASH 2.7V PROM, PDSO16, 0.300 INCH, GREEN, SOIC-16 | Winbond Electronics Corp | MX25L1608DMI-12G vs NX25P16-VFI-G |
| M25P16-VMF6P | Flash, 2MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 | Numonyx Memory Solutions | MX25L1608DMI-12G vs M25P16-VMF6P |
| NX25P16-VFI | 16MX1 FLASH 2.7V PROM, PDSO16, 0.300 INCH, SOIC-16 | Winbond Electronics Corp | MX25L1608DMI-12G vs NX25P16-VFI |
| MR27V1641L-XXXMPZ03D | MASK ROM, 16MX1, CMOS, PDSO16, 0.375 INCH, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, SOP-16 | LAPIS Semiconductor Co Ltd | MX25L1608DMI-12G vs MR27V1641L-XXXMPZ03D |