Part Details for S29GL256S90FHA020 by Infineon Technologies AG
Overview of S29GL256S90FHA020 by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S29GL256S90FHA020
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S29GL256S90FHA020-ND
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DigiKey | IC FLASH 256MBIT PARALLEL 64FBGA Min Qty: 1800 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$6.1243 | Buy Now |
DISTI #
727-S29GL256S90FA020
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Mouser Electronics | NOR Flash Nor RoHS: Compliant | 0 |
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$6.0200 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 1800 Package Multiple: 1800 Lead time: 8 Weeks | 0 |
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$5.4900 | Buy Now |
|
Flip Electronics | Stock | 8104 |
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RFQ |
Part Details for S29GL256S90FHA020
S29GL256S90FHA020 CAD Models
S29GL256S90FHA020 Part Data Attributes
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S29GL256S90FHA020
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S29GL256S90FHA020
Infineon Technologies AG
Flash, 32MX8, 90ns, PBGA64,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Access Time-Max | 90 ns | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B64 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Sectors/Size | 256 | |
Number of Terminals | 64 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA64,8X8,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Page Size | 16 words | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3 V | |
Ready/Busy | YES | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.4 mm | |
Sector Size | 64K | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Toggle Bit | YES | |
Type | NOR TYPE | |
Width | 11 mm |