Datasheets
V58C2256164SALD-6 by: ProMOS Technologies Inc

DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, DIE-STACKED, TSOP2-66

Part Details for V58C2256164SALD-6 by ProMOS Technologies Inc

Overview of V58C2256164SALD-6 by ProMOS Technologies Inc

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Applications Consumer Electronics Computing and Data Storage

Part Details for V58C2256164SALD-6

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V58C2256164SALD-6 Part Data Attributes:

V58C2256164SALD-6 ProMOS Technologies Inc
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V58C2256164SALD-6 ProMOS Technologies Inc DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, DIE-STACKED, TSOP2-66
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer PROMOS TECHNOLOGIES INC
Part Package Code TSOP2
Package Description TSOP2,
Pin Count 66
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G66
Length 22.22 mm
Memory Density 268435456 bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 66
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16MX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm

Alternate Parts for V58C2256164SALD-6

This table gives cross-reference parts and alternative options found for V58C2256164SALD-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of V58C2256164SALD-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
V58C2256164SBLT6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SBLT6
MT46V16M16P-6RITH 16MX16 DDR DRAM, 0.7ns, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc V58C2256164SALD-6 vs MT46V16M16P-6RITH
V58C2256164SGLI-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SGLI-6
K4H561638F-TLB30 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor V58C2256164SALD-6 vs K4H561638F-TLB30
V58C2256164SCE6I DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC TSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SCE6I
K4D551638D-LC600 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 Samsung Semiconductor V58C2256164SALD-6 vs K4D551638D-LC600
W9425G6JH-5I DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, ROHS COMPLIANT, TSOP2-66 Winbond Electronics Corp V58C2256164SALD-6 vs W9425G6JH-5I
K4H561638F-ULB30 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor V58C2256164SALD-6 vs K4H561638F-ULB30
MT46V16M16P-6TLITH 16MX16 DDR DRAM, 0.7ns, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc V58C2256164SALD-6 vs MT46V16M16P-6TLITH
EDD2516AKTA-6BTI-E DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66 Elpida Memory Inc V58C2256164SALD-6 vs EDD2516AKTA-6BTI-E
Part Number Description Manufacturer Compare
V58C2256164SHUD6E DDR DRAM, 16MX16, CMOS, PDSO66, 0.400 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SHUD6E
V58C2256164SHLD6 DDR DRAM, 16MX16, CMOS, PDSO66, 0.400 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SHLD6
HY5DU561622ETP-5 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, LEAD FREE, TSOP2-66 SK Hynix Inc V58C2256164SALD-6 vs HY5DU561622ETP-5
K4H561638H-ULB30 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor V58C2256164SALD-6 vs K4H561638H-ULB30
V58C2256164SBI6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, LEAD FREE, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SBI6
IS43R16160B-6TL DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, TSOP2-66 Integrated Silicon Solution Inc V58C2256164SALD-6 vs IS43R16160B-6TL
NT5DS16M16BS-6K DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 INCH, LEAD AND HALOGEN FREE, PLASTIC, TSOP2-66 Nanya Technology Corporation V58C2256164SALD-6 vs NT5DS16M16BS-6K
K4H561638J-LCB3T00 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor V58C2256164SALD-6 vs K4H561638J-LCB3T00
EDD2516AMTA-6B-E DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, ROHS COMPLIANT, PLASTIC, TSOP2-66 Elpida Memory Inc V58C2256164SALD-6 vs EDD2516AMTA-6B-E
V58C2256164SCLE6 DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc V58C2256164SALD-6 vs V58C2256164SCLE6

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