Part Details for W25Q32JVSSJM by Winbond Electronics Corp
Overview of W25Q32JVSSJM by Winbond Electronics Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for W25Q32JVSSJM
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W25Q32JVSSJM-ND
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DigiKey | IC FLASH 32MBIT SPI/QUAD 8SOIC Lead time: 22 Weeks Container: Tube | Temporarily Out of Stock |
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Part Details for W25Q32JVSSJM
W25Q32JVSSJM CAD Models
W25Q32JVSSJM Part Data Attributes:
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W25Q32JVSSJM
Winbond Electronics Corp
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Datasheet
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W25Q32JVSSJM
Winbond Electronics Corp
Flash,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | SOP, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Date Of Intro | 2018-04-03 | |
| Additional Feature | IT ALSO OPERATES AT 2.7 TO 3.0 V SUPPLY VOLTAGE AT 104 MHZ FREQUENCY | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| JESD-30 Code | S-PDSO-G8 | |
| Length | 5.23 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 2.16 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 5.23 mm |
Alternate Parts for W25Q32JVSSJM
This table gives cross-reference parts and alternative options found for W25Q32JVSSJM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q32JVSSJM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25Q32JVSSIM | Flash, 4MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q32JVSSJM vs W25Q32JVSSIM |
| W25Q32JVSSJQ | Flash, 4MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q32JVSSJM vs W25Q32JVSSJQ |
| W25Q32JVSSSQ | Flash, 4MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q32JVSSJM vs W25Q32JVSSSQ |
| W25Q32JVSSIQTR | Flash, 4MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q32JVSSJM vs W25Q32JVSSIQTR |
| W25Q32JVSSAQ | Flash, 4MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q32JVSSJM vs W25Q32JVSSAQ |
| EN25QH32B-104HIP2B | Flash, 4MX8, PDSO8, SOP-8 | Elite Semiconductor Memory Technology Inc | W25Q32JVSSJM vs EN25QH32B-104HIP2B |