Part Details for AM27C256-200DC by AMD
Overview of AM27C256-200DC by AMD
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for AM27C256-200DC
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 53 |
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RFQ | ||
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Bristol Electronics | Min Qty: 1 | 216 |
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$3.2144 / $7.8400 | Buy Now |
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Bristol Electronics | 75 |
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RFQ | ||
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 5 |
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$3.7500 / $7.5000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 1 |
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$7.5000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 15 |
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$5.6000 / $8.4000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 172 |
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$4.5500 / $10.5000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 3 |
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$7.5000 / $15.0000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 54 |
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$23.4809 / $27.6246 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 51 |
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$31.2800 / $36.8000 | Buy Now |
Part Details for AM27C256-200DC
AM27C256-200DC CAD Models
AM27C256-200DC Part Data Attributes
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AM27C256-200DC
AMD
Buy Now
Datasheet
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Compare Parts:
AM27C256-200DC
AMD
UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WINDOWED, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-200DC
This table gives cross-reference parts and alternative options found for AM27C256-200DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-200DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TMS87C257-2JE | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-200DC vs TMS87C257-2JE |
| AM27256-20DE | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-200DC vs AM27256-20DE |
| HN27C256G-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERDIP-28 | Hitachi Ltd | AM27C256-200DC vs HN27C256G-20 |
| AM27256-2DC | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-200DC vs AM27256-2DC |
| AM27C256-205DC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-200DC vs AM27C256-205DC |
| TMM27256BDI-20 | IC 32K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | AM27C256-200DC vs TMM27256BDI-20 |
| NMC27C256BQ20 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-200DC vs NMC27C256BQ20 |
| TMS27C256-20JE4 | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C256-200DC vs TMS27C256-20JE4 |
| AM27C256-200DCB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-200DC vs AM27C256-200DCB |
| NMC27C256BQE200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-200DC vs NMC27C256BQE200 |