Part Details for AM27LS19/BEA by AMD
Overview of AM27LS19/BEA by AMD
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for AM27LS19/BEA
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 6 |
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RFQ | ||
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Quest Components | OTP ROM, 32X8, 70NS, BIPOLAR, CDIP16 | 9 |
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Buy Now | |
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Quest Components | OTP ROM, 32X8, 70NS, BIPOLAR, CDIP16 | 12 |
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$27.6289 / $29.0830 | Buy Now |
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Quest Components | OTP ROM, 32X8, 70NS, BIPOLAR, CDIP16 | 30 |
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$31.4096 / $34.8996 | Buy Now |
Part Details for AM27LS19/BEA
AM27LS19/BEA CAD Models
AM27LS19/BEA Part Data Attributes
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AM27LS19/BEA
AMD
Buy Now
Datasheet
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AM27LS19/BEA
AMD
OTP ROM, 32X8, 70ns, Bipolar, CDIP16, CERAMIC, DIP-16
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-GDIP-T16 | |
| JESD-609 Code | e0 | |
| Length | 19.431 mm | |
| Memory Density | 256 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 32 words | |
| Number of Words Code | 32 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM27LS19/BEA
This table gives cross-reference parts and alternative options found for AM27LS19/BEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS19/BEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDM29750JC | 32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | AM27LS19/BEA vs IDM29750JC |
| M54730AS-2 | OTP ROM, 32X8, 35ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 | Mitsubishi Electric | AM27LS19/BEA vs M54730AS-2 |
| AM27S19SAPCB | OTP ROM, 32X8, 15ns, Bipolar, PDIP16, PLASTIC, DIP-16 | AMD | AM27LS19/BEA vs AM27S19SAPCB |
| N82S123B | IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM | NXP Semiconductors | AM27LS19/BEA vs N82S123B |
| DM74S288AJ | 32X8 OTPROM, 25ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | AM27LS19/BEA vs DM74S288AJ |
| S82S123F883B | 32X8 OTPROM, 65ns, CDIP16, DIP-16 | Philips Semiconductors | AM27LS19/BEA vs S82S123F883B |
| DM54S288J/883C | 32X8 OTPROM, 45ns, CDIP16, CERAMIC, DIP-16 | Texas Instruments | AM27LS19/BEA vs DM54S288J/883C |
| M38510/20703BEX | OTP ROM, 32X8, 35ns, Bipolar, 0.25 X 0.875 INCH, DIP-16 | Lansdale Semiconductor Inc | AM27LS19/BEA vs M38510/20703BEX |
| 82S23/BEA | IC 32 X 8 OTPROM, 50 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | AM27LS19/BEA vs 82S23/BEA |
| N82S123N | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | YAGEO Corporation | AM27LS19/BEA vs N82S123N |