Datasheets
GS8182T19BD-435M by: GSI Technology

DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165

Part Details for GS8182T19BD-435M by GSI Technology

Overview of GS8182T19BD-435M by GSI Technology

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Applications Industrial Automation

Price & Stock for GS8182T19BD-435M

Part # Distributor Description Stock Price Buy
DISTI # GS8182T19BD-435M
Avnet Americas SRAM Chip Sync Single 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8182T19BD-435M) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $164.3400
  • 288 $161.3520
  • 576 $153.3840
  • 864 $149.4000
  • 1,152 $144.4200
  • 1,440 $137.4480
  • 14,400 $133.4640
$133.4640 / $164.3400 Buy Now
DISTI # GS8182T19BD-435M
Avnet Americas SRAM Chip Sync Single 1.8V 18M-Bit 1M x 18 0.45ns 165-Pin FBGA - Bulk (Alt: GS8182T19BD-435M) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $164.3400
  • 288 $161.3520
  • 576 $153.3840
  • 864 $149.4000
  • 1,152 $144.4200
  • 1,440 $137.4480
  • 14,400 $133.4640
$133.4640 / $164.3400 Buy Now

Part Details for GS8182T19BD-435M

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GS8182T19BD-435M Part Data Attributes:

GS8182T19BD-435M GSI Technology
Buy Now Datasheet
Compare Parts:
GS8182T19BD-435M GSI Technology DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA,
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
JESD-30 Code R-PBGA-B165
Length 15 mm
Memory Density 18874368 bit
Memory IC Type DDR SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 1MX18
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for GS8182T19BD-435M

This table gives cross-reference parts and alternative options found for GS8182T19BD-435M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8182T19BD-435M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
71V2556XS100BGI8 ZBT SRAM, 128KX36, CMOS, PBGA119, BGA-119 Integrated Device Technology Inc GS8182T19BD-435M vs 71V2556XS100BGI8
CY7C1145KV18-450BZXC QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8182T19BD-435M vs CY7C1145KV18-450BZXC
CY7C2268KV18-550BZC DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8182T19BD-435M vs CY7C2268KV18-550BZC
R1Q3A3636ABG-33R 1MX36 QDR SRAM, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165 Renesas Electronics Corporation GS8182T19BD-435M vs R1Q3A3636ABG-33R
GS841E18AI-133I Cache Tag SRAM, 256KX18, 11ns, CMOS, PBGA119, FBGA-119 GSI Technology GS8182T19BD-435M vs GS841E18AI-133I
GS8161E36DGD-333I Cache SRAM, 512KX36, 4.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8182T19BD-435M vs GS8161E36DGD-333I
GS8161E36DGD-150 Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8182T19BD-435M vs GS8161E36DGD-150
IDT71V2548XS133PF ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MO-136DJ, TQFP-100 Integrated Device Technology Inc GS8182T19BD-435M vs IDT71V2548XS133PF
IDT71V2548S100B ZBT SRAM, 256KX18, 5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028AA, BGA-119 Integrated Device Technology Inc GS8182T19BD-435M vs IDT71V2548S100B
GS8162Z18DD-150IVT ZBT SRAM, 1MX18, 7.5ns, CMOS, PBGA165, FPBGA-165 GSI Technology GS8182T19BD-435M vs GS8162Z18DD-150IVT

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