Part Details for IS61DDB24M18A-250M3L by Integrated Silicon Solution Inc
Overview of IS61DDB24M18A-250M3L by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for IS61DDB24M18A-250M3L
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS61DDB24M18A-250M3L-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165LFBGA Min Qty: 105 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$47.3701 | Buy Now |
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DISTI #
IS61DDB24M18A-250M
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Avnet Americas | DDR-II (Burst 2) CIO Synchronous SRAM 72Mb 4Mx18 250MHz 1.8V 165-Pin FBGA Tray - Trays (Alt: IS61DDB24M18A-250M) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 28 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
870-61B24M18A250M3L
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Mouser Electronics | SRAM 72Mb, DDR II (Burst of 2) CIO, Sync SRAM, 4M x 18, 165 Ball FBGA (15x17 mm), RoHS RoHS: Compliant | 0 |
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$45.9800 | Order Now |
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DISTI #
IS61DDB24M18A-250M
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Avnet Americas | DDR-II (Burst 2) CIO Synchronous SRAM 72Mb 4Mx18 250MHz 1.8V 165-Pin FBGA Tray - Trays (Alt: IS61DDB24M18A-250M) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 28 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for IS61DDB24M18A-250M3L
IS61DDB24M18A-250M3L CAD Models
IS61DDB24M18A-250M3L Part Data Attributes:
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IS61DDB24M18A-250M3L
Integrated Silicon Solution Inc
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Datasheet
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Compare Parts:
IS61DDB24M18A-250M3L
Integrated Silicon Solution Inc
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 28 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.89 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15 mm |
Alternate Parts for IS61DDB24M18A-250M3L
This table gives cross-reference parts and alternative options found for IS61DDB24M18A-250M3L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61DDB24M18A-250M3L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8662D19BD-300I | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | IS61DDB24M18A-250M3L vs GS8662D19BD-300I |
| CY7C1625KV18-200BZXI | QDR SRAM, 16MX9, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 | Cypress Semiconductor | IS61DDB24M18A-250M3L vs CY7C1625KV18-200BZXI |
| GS81302T07GE-450T | DDR SRAM, 16MX8, 0.37ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | IS61DDB24M18A-250M3L vs GS81302T07GE-450T |
| K7I320884M-FC13 | DDR SRAM, 4MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | IS61DDB24M18A-250M3L vs K7I320884M-FC13 |
| GS8662D20BD-350 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | IS61DDB24M18A-250M3L vs GS8662D20BD-350 |
| IS61QDPB24M18A-333M3 | QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | IS61DDB24M18A-250M3L vs IS61QDPB24M18A-333M3 |
| IS61DDB44M18A-300B4L | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | IS61DDB24M18A-250M3L vs IS61DDB44M18A-300B4L |
| IS61DDPB24M18A-450B4 | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | IS61DDB24M18A-250M3L vs IS61DDPB24M18A-450B4 |
| IS61DDPB44M18A-550M3LI | DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | IS61DDB24M18A-250M3L vs IS61DDPB44M18A-550M3LI |
| MT57W4MH8JF-6 | DDR SRAM, 4MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Micron Technology Inc | IS61DDB24M18A-250M3L vs MT57W4MH8JF-6 |