Datasheets
L8C401CMB25 by: LOGIC Devices Inc

FIFO, 64X4, 35ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16

Part Details for L8C401CMB25 by LOGIC Devices Inc

Overview of L8C401CMB25 by LOGIC Devices Inc

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Part Details for L8C401CMB25

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L8C401CMB25 Part Data Attributes

L8C401CMB25 LOGIC Devices Inc
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L8C401CMB25 LOGIC Devices Inc FIFO, 64X4, 35ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer LOGIC DEVICES INC
Part Package Code DIP
Package Description DIP,
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 35 ns
Cycle Time 40 ns
JESD-30 Code R-GDIP-T16
Length 20.32 mm
Memory Density 256 bit
Memory Width 4
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 16
Number of Words 64 words
Number of Words Code 64
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 64X4
Output Characteristics TOTEM POLE
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for L8C401CMB25

This table gives cross-reference parts and alternative options found for L8C401CMB25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L8C401CMB25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
L8C401CM25 FIFO, 64X4, 35ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16 LOGIC Devices Inc L8C401CMB25 vs L8C401CM25
Part Number Description Manufacturer Compare
5962-8779101EX FIFO, 64X4, 70ns, Asynchronous, TTL, CDIP16, CERAMIC, DIP-16 AMD L8C401CMB25 vs 5962-8779101EX
L8C403CME20 FIFO, 64X4, 45ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16 LOGIC Devices Inc L8C401CMB25 vs L8C403CME20
AM67C4013-35JC FIFO, 64X4, 20ns, Asynchronous, CMOS, CDIP20 AMD L8C401CMB25 vs AM67C4013-35JC
IDT72403L45D FIFO, 64X4, 19ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16 Integrated Device Technology Inc L8C401CMB25 vs IDT72403L45D
72401L25PDG FIFO, 64X4, Asynchronous, CMOS, PDIP16 Integrated Device Technology Inc L8C401CMB25 vs 72401L25PDG
72401L45PDG FIFO, 64X4, Asynchronous, CMOS, PDIP16 Integrated Device Technology Inc L8C401CMB25 vs 72401L45PDG
5962-8779105EA FIFO, 64X4, 70ns, Asynchronous, TTL, CDIP16, CERAMIC, DIP-16 Monolithic Memories (RETIRED) L8C401CMB25 vs 5962-8779105EA
72403L10DG FIFO, 64X4, Asynchronous, CMOS, CDIP16 Integrated Device Technology Inc L8C401CMB25 vs 72403L10DG
IDT72403L35DB FIFO, 64X4, 20ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16 Integrated Device Technology Inc L8C401CMB25 vs IDT72403L35DB
67401J FIFO, 64X4, Asynchronous, TTL, CDIP16, DIP-16 Monolithic Memories Inc (MMI) L8C401CMB25 vs 67401J

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