Datasheets
MB81C1001-12LC by:

Nibble Mode DRAM, 1MX1, 120ns, CMOS, CDIP18, SIDE BRAZED, METAL SEALED, CERAMIC, DIP-18

Part Details for MB81C1001-12LC by FUJITSU Semiconductor Limited

Overview of MB81C1001-12LC by FUJITSU Semiconductor Limited

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Part Details for MB81C1001-12LC

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MB81C1001-12LC Part Data Attributes

MB81C1001-12LC FUJITSU Semiconductor Limited
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MB81C1001-12LC FUJITSU Semiconductor Limited Nibble Mode DRAM, 1MX1, 120ns, CMOS, CDIP18, SIDE BRAZED, METAL SEALED, CERAMIC, DIP-18
Part Life Cycle Code Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC
Package Description DIP,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode NIBBLE
Access Time-Max 120 ns
Additional Feature RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 Code R-CDIP-T18
Length 22.86 mm
Memory Density 1048576 bit
Memory IC Type NIBBLE MODE DRAM
Memory Width 1
Number of Functions 1
Number of Ports 1
Number of Terminals 18
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX1
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Qualification Status Not Qualified
Refresh Cycles 512
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for MB81C1001-12LC

This table gives cross-reference parts and alternative options found for MB81C1001-12LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MB81C1001-12LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
UPD421001C-12 Nibble Mode DRAM, 1MX1, 120ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 NEC Electronics America Inc MB81C1001-12LC vs UPD421001C-12
Part Number Description Manufacturer Compare
JM38510/24903BVC Fast Page DRAM, 1MX1, 120ns, CMOS, CDIP18, 0.400 INCH, CERAMIC, DIP-18 Micross Components MB81C1001-12LC vs JM38510/24903BVC
MCM51L1000AP80 1MX1 FAST PAGE DRAM, 80ns, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Motorola Mobility LLC MB81C1001-12LC vs MCM51L1000AP80
KM41C1000CLP-8 Fast Page DRAM, 1MX1, 80ns, CMOS, PDIP18, PLASTIC, DIP-18 Samsung Semiconductor MB81C1001-12LC vs KM41C1000CLP-8
EDI411024C80QC Fast Page DRAM, 1MX1, 80ns, CMOS, PDIP18, Electronic Designs Inc MB81C1001-12LC vs EDI411024C80QC
HM511002AP-12 Static Column DRAM, 1MX1, 120ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Hitachi Ltd MB81C1001-12LC vs HM511002AP-12
MSM511001B-80RS Nibble Mode DRAM, 1MX1, 80ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 OKI Electric Industry Co Ltd MB81C1001-12LC vs MSM511001B-80RS
UPD421001C-10 Nibble Mode DRAM, 1MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18 NEC Electronics America Inc MB81C1001-12LC vs UPD421001C-10
TMS4C1027-80N 1MX1 STATIC COLUMN DRAM, 80ns, PDIP18 Texas Instruments MB81C1001-12LC vs TMS4C1027-80N
V53C100HP50L Fast Page DRAM, 1MX1, 50ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Mosel Vitelic Corporation MB81C1001-12LC vs V53C100HP50L
M38510/24904BVX 1KX1 PAGE MODE DRAM, 150ns, DIP18, 0.960 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-16 Texas Instruments MB81C1001-12LC vs M38510/24904BVX

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