Part Details for S25FL256SAGBHI210 by Cypress Semiconductor
Overview of S25FL256SAGBHI210 by Cypress Semiconductor
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Price & Stock for S25FL256SAGBHI210
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
76T1524
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Newark | Nor/Tray |Cypress Infineon Technologies S25FL256SAGBHI210 Min Qty: 3380 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
DISTI #
2832-S25FL256SAGBHI210-ND
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DigiKey | IC FLASH 256MBIT SPI/QUAD 24BGA Min Qty: 150 Lead time: 1 Weeks Container: Tray MARKETPLACE PRODUCT |
887 In Stock |
|
$3.7600 | Buy Now |
|
Rochester Electronics | S25FL256S - 256-Mbit, 3.0V CMOS Flash Memory RoHS: Compliant Status: Active Min Qty: 1 | 685 |
|
$3.2500 / $3.8200 | Buy Now |
|
Flip Electronics | Stock, ship today | 1217 |
|
$2.8100 | RFQ |
Part Details for S25FL256SAGBHI210
S25FL256SAGBHI210 CAD Models
S25FL256SAGBHI210 Part Data Attributes
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S25FL256SAGBHI210
Cypress Semiconductor
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Datasheet
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Compare Parts:
S25FL256SAGBHI210
Cypress Semiconductor
Flash, 64MX4, PBGA24, FBGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.A | |
HTS Code | 8542.32.00.51 | |
Additional Feature | ALSO CONFIGURABLE AS 128M X 1 | |
Alternate Memory Width | 2 | |
Boot Block | BOTTOM | |
Clock Frequency-Max (fCLK) | 133 MHz | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B24 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX4 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA24,5X5,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Type | NOR TYPE | |
Width | 6 mm | |
Write Cycle Time-Max (tWC) | 500 ms | |
Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S25FL256SAGBHI210
This table gives cross-reference parts and alternative options found for S25FL256SAGBHI210. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FL256SAGBHI210, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
S25FL256SAGBHI210 | Flash, 64MX4, PBGA24, | Infineon Technologies AG | S25FL256SAGBHI210 vs S25FL256SAGBHI210 |