Part Details for S25FL512SAGBHID13 by Cypress Semiconductor
Overview of S25FL512SAGBHID13 by Cypress Semiconductor
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S25FL512SAGBHID13
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
89T3251
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Newark | Nor/Reel |Cypress Infineon Technologies S25FL512SAGBHID13 Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
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Part Details for S25FL512SAGBHID13
S25FL512SAGBHID13 CAD Models
S25FL512SAGBHID13 Part Data Attributes
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S25FL512SAGBHID13
Cypress Semiconductor
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Datasheet
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S25FL512SAGBHID13
Cypress Semiconductor
Flash, 128MX4, PBGA24, FBGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Package Description | BGA-24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Alternate Memory Width | 1 | |
| Boot Block | BOTTOM/TOP | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 512753664 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 64094208 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,4X6,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S25FL512SAGBHID13
This table gives cross-reference parts and alternative options found for S25FL512SAGBHID13. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FL512SAGBHID13, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S25FL512SAGBHID10 | Flash, 64MX8, PBGA24, BGA-24 | Infineon Technologies AG | S25FL512SAGBHID13 vs S25FL512SAGBHID10 |
| S25FL512SAGBHID10 | Flash, 128MX4, PBGA24, FBGA-24 | Spansion | S25FL512SAGBHID13 vs S25FL512SAGBHID10 |
| S25FL512SAGBHID13 | Flash, 128MX4, PBGA24, FBGA-24 | Spansion | S25FL512SAGBHID13 vs S25FL512SAGBHID13 |
| S25FL512SAGBHID13 | Flash, 64MX8, PBGA24, BGA-24 | Infineon Technologies AG | S25FL512SAGBHID13 vs S25FL512SAGBHID13 |