| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| STD830CP40 | STMicroelectronics | Check for Price | Power Bipolar Transistor, 3A I(C), 400V V(BR)CEO, 2-Element, NPN and PNP, Silicon, Plastic/Epoxy, 8 Pin | STD815CP40 vs STD830CP40 |
Part Details for STD815CP40 by STMicroelectronics
Results Overview of STD815CP40 by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Not Available)
- Number of Functional Equivalents: (1 option)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
STD815CP40 Information
STD815CP40 by STMicroelectronics is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for STD815CP40
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Power Bipolar Transistor, 1.5A I(C), 400V V(BR)CEO, 2-Element, NPN and PNP, Silicon, Plastic/Epoxy, 8 Pin | 13391 |
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RFQ |
STD815CP40 Part Data Attributes
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STD815CP40
STMicroelectronics
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Datasheet
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STD815CP40
STMicroelectronics
Power Bipolar Transistor, 1.5A I(C), 400V V(BR)CEO, 2-Element, NPN and PNP, Silicon, Plastic/Epoxy, 8 Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | DIP | |
| Package Description | Dip-8 | |
| Pin Count | 8 | |
| ECCN Code | EAR99 | |
| Collector Current-Max (IC) | 1.5 A | |
| Collector-Emitter Voltage-Max | 400 V | |
| Configuration | Separate, 2 Elements | |
| DC Current Gain-Min (hFE) | 4 | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e3 | |
| Number of Elements | 2 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Shape | Rectangular | |
| Package Style | In-Line | |
| Polarity/Channel Type | Npn And Pnp | |
| Qualification Status | Not Qualified | |
| Surface Mount | No | |
| Terminal Finish | Matte Tin (Sn) - Annealed | |
| Terminal Form | Through-Hole | |
| Terminal Position | Dual | |
| Transistor Application | Switching | |
| Transistor Element Material | Silicon |
Alternate Parts for STD815CP40
This table gives cross-reference parts and alternative options found for STD815CP40. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of STD815CP40, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
STD815CP40 Frequently Asked Questions (FAQ)
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The recommended operating temperature range for STD815CP40 is -40°C to 125°C, but it can tolerate up to 150°C for short periods.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing power dissipation.
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The maximum allowable voltage on the input pins of STD815CP40 is 5.5V, but it's recommended to keep the input voltage within the specified operating range (VCC - 0.5V to VCC + 0.5V) to ensure reliable operation.
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STD815CP40 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures, such as using ESD-safe equipment, wrist straps, and mats, to prevent damage during handling and assembly.
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For optimal performance and signal integrity, it's recommended to follow STMicroelectronics' guidelines for PCB layout and routing, including using a solid ground plane, minimizing trace lengths, and avoiding signal routing near the device's power pins.