| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TIP30A | Bourns Inc | Check for Price | Power Bipolar Transistor, 1A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin | TIP30A vs TIP30A |
| TIP30A | Baneasa SA | Check for Price | Power Bipolar Transistor, 2A I(C), 1-Element, PNP, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin | TIP30A vs TIP30A |
| TIP30A | onsemi | Check for Price | Power Bipolar Transistor, 1A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin | TIP30A vs TIP30A |
Part Details for TIP30A by STMicroelectronics
Results Overview of TIP30A by STMicroelectronics
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (3 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (10 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TIP30A Information
TIP30A by STMicroelectronics is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for TIP30A
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
497-2610-5-ND
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DigiKey | TRANS PNP 60V 1A TO-220 Min Qty: 3000 Container: Tube |
0 Tube |
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$0.2828 | Buy Now |
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Quest Components | TRANSISTOR,BJT,PNP,60V V(BR)CEO,1A I(C),TO-220AB | 112 |
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$0.4200 / $0.7000 | Buy Now |
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Quest Components | TRANSISTOR,BJT,PNP,60V V(BR)CEO,1A I(C),TO-220AB | 7 |
|
$0.4200 | Buy Now |
US Tariff Estimator: TIP30A by STMicroelectronics
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
TIP30A Part Data Attributes
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TIP30A
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
TIP30A
STMicroelectronics
Power Bipolar Transistor, 1A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | TO-220AB | |
| Package Description | To-220, 3 Pin | |
| Pin Count | 3 | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Collector Current-Max (IC) | 1 A | |
| Collector-Emitter Voltage-Max | 60 V | |
| Configuration | Single | |
| DC Current Gain-Min (hFE) | 15 | |
| JEDEC-95 Code | TO-220AB | |
| JESD-30 Code | R-PSFM-T3 | |
| JESD-609 Code | e3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Shape | Rectangular | |
| Package Style | Flange Mount | |
| Polarity/Channel Type | Pnp | |
| Power Dissipation Ambient-Max | 30 W | |
| Power Dissipation-Max (Abs) | 30 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | No | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | Through-Hole | |
| Terminal Position | Single | |
| Transistor Application | Switching | |
| Transistor Element Material | Silicon | |
| Transition Frequency-Nom (fT) | 3 Mhz | |
| VCEsat-Max | 0.7 V |
Alternate Parts for TIP30A
This table gives cross-reference parts and alternative options found for TIP30A. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TIP30A, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
TIP30A Frequently Asked Questions (FAQ)
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The maximum safe operating area (SOA) for the TIP30A is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and voltage and current ratings. As a general rule, it's recommended to operate the device within the boundaries of the SOA curve to ensure reliable operation and prevent thermal runaway.
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To calculate the thermal resistance of the TIP30A in a specific application, you need to consider the device's junction-to-case thermal resistance (RθJC), case-to-ambient thermal resistance (RθCA), and the thermal interface material (TIM) thermal resistance (RθTIM). You can use the following formula: RθJA = RθJC + RθCA + RθTIM. The datasheet provides the RθJC value, and you can estimate the RθCA and RθTIM values based on the application's thermal design and materials used.
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For optimal thermal management, it's recommended to use a PCB layout that provides good thermal conduction and heat dissipation. This includes using a large copper area for the drain pin, placing the device near a heat sink or thermal pad, and using thermal vias to dissipate heat to the opposite side of the board. Additionally, ensure that the PCB material and thickness are suitable for the application's thermal requirements.
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While the TIP30A is a power transistor, it's not optimized for high-frequency switching applications. The device's switching characteristics, such as rise and fall times, are not specified in the datasheet, and it may not be suitable for high-frequency applications. For high-frequency switching, consider using a transistor specifically designed for that purpose, such as a MOSFET or IGBT.
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To protect the TIP30A from electrostatic discharge (ESD), follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. In the circuit design, consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to absorb or divert ESD pulses. Additionally, ensure that the PCB layout and component placement minimize the risk of ESD damage.