Memory
W27C4096-12
Winbond Electronics Corp
Description: EEPROM, 256KX16, 120ns, Parallel, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40

Overview of W27C4096-12 by Winbond Electronics Corp

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage

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Part Data Attributes for W27C4096-12 by Winbond Electronics Corp

W27C4096-12
Winbond Electronics Corp
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
Part Package Code
DIP
Package Description
0.600 INCH, PLASTIC, DIP-40
Pin Count
40
Reach Compliance Code
not_compliant
ECCN Code
3A991.B.1.B.1
HTS Code
8542.32.00.51
Access Time-Max
120 ns
Command User Interface
NO
Data Polling
NO
JESD-30 Code
R-PDIP-T40
JESD-609 Code
e0
Length
52.2 mm
Memory Density
4194304 bit
Memory IC Type
EEPROM
Memory Width
16
Number of Functions
1
Number of Terminals
40
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
50 °C
Operating Temperature-Min
Organization
256KX16
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
12 V
Qualification Status
Not Qualified
Seated Height-Max
5.33 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Toggle Bit
NO
Width
15.24 mm
Want to compare parts?
  1. W27C4096-12
    Winbond Electronics Corp
    EEPROM, 256KX16, 120ns, Parallel, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40
    VS

Alternate Parts for W27C4096-12

This table gives cross-reference parts and alternative options found for W27C4096-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27C4096-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
W27E4096-12 EEPROM, 256KX16, 120ns, Parallel, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Winbond Electronics Corp W27C4096-12 vs W27E4096-12
Part Number Description Manufacturer Compare
WE256K16-300CMA EEPROM Module, 256KX16, 300ns, Parallel, CMOS, CDMA40, Microsemi Corporation W27C4096-12 vs WE256K16-300CMA
WE256K16-300CM EEPROM Module, 256KX16, 300ns, Parallel, CMOS, CDMA40, White Electronic Designs Corp W27C4096-12 vs WE256K16-300CM
WE256K16-150CQA EEPROM Module, 256KX16, 150ns, Parallel, CMOS, CDMA40, Microsemi Corporation W27C4096-12 vs WE256K16-150CQA
XM28C4096-15 EEPROM Module, 256KX16, 150ns, Parallel, CMOS, Xicor Inc W27C4096-12 vs XM28C4096-15
WE256K16-200CQA EEPROM Module, 256KX16, 200ns, Parallel, CMOS, CDMA40, Microsemi Corporation W27C4096-12 vs WE256K16-200CQA
WE256K16-250CC EEPROM Module, 256KX16, 250ns, Parallel, CMOS, CDMA40, White Electronic Designs Corp W27C4096-12 vs WE256K16-250CC
WE256K16-250CI EEPROM Module, 256KX16, 250ns, Parallel, CMOS, CDMA40, White Electronic Designs Corp W27C4096-12 vs WE256K16-250CI
WE256K16-200CQ EEPROM Module, 256KX16, 200ns, Parallel, CMOS, CDMA40, Microsemi Corporation W27C4096-12 vs WE256K16-200CQ
WE256K16-250CCA EEPROM Module, 256KX16, 250ns, Parallel, CMOS, CDMA40, Microsemi Corporation W27C4096-12 vs WE256K16-250CCA
W27C4096-15 EEPROM, 256KX16, 150ns, Parallel, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Winbond Electronics Corp W27C4096-12 vs W27C4096-15

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