Part Details for W27E01-70 by Winbond Electronics Corp
Overview of W27E01-70 by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for W27E01-70
W27E01-70 CAD Models
W27E01-70 Part Data Attributes
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W27E01-70
Winbond Electronics Corp
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Datasheet
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W27E01-70
Winbond Electronics Corp
EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Part Package Code | DIP | |
Package Description | DIP, DIP32,.6 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.1.B.2 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 70 ns | |
Command User Interface | NO | |
Data Polling | NO | |
JESD-30 Code | R-PDIP-T32 | |
Length | 41.91 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.33 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Toggle Bit | NO | |
Width | 15.24 mm |
Alternate Parts for W27E01-70
This table gives cross-reference parts and alternative options found for W27E01-70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27E01-70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MX26C1000APC-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | W27E01-70 vs MX26C1000APC-70 |
MX26C1000PC-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32 | Macronix International Co Ltd | W27E01-70 vs MX26C1000PC-70 |
W27C010-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Winbond Electronics Corp | W27E01-70 vs W27C010-70 |
W27C01-70 | EEPROM, 128KX8, 70ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Winbond Electronics Corp | W27E01-70 vs W27C01-70 |