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Overview of W28F321BB70L by Winbond Electronics Corp
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for W28F321BB70L by Winbond Electronics Corp
Part Data Attributes for W28F321BB70L by Winbond Electronics Corp
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
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Part Package Code
|
BGA
|
Package Description
|
7 X 7 MM, 0.75 MM PITCH, TFBGA-48
|
Pin Count
|
48
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Access Time-Max
|
70 ns
|
Boot Block
|
BOTTOM
|
Command User Interface
|
YES
|
Common Flash Interface
|
YES
|
Data Polling
|
NO
|
JESD-30 Code
|
S-PBGA-B48
|
JESD-609 Code
|
e0
|
Length
|
7 mm
|
Memory Density
|
33554432 bit
|
Memory IC Type
|
FLASH
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Memory Width
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16
|
Number of Functions
|
1
|
Number of Sectors/Size
|
8,63
|
Number of Terminals
|
48
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
2MX16
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TFBGA
|
Package Equivalence Code
|
BGA48,6X8,30
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Page Size
|
8 words
|
Parallel/Serial
|
PARALLEL
|
Programming Voltage
|
1.8 V
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.05 mm
|
Sector Size
|
4K,32K
|
Standby Current-Max
|
0.00002 A
|
Supply Current-Max
|
0.06 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.75 mm
|
Terminal Position
|
BOTTOM
|
Toggle Bit
|
NO
|
Type
|
NOR TYPE
|
Width
|
7 mm
|