Part Details for W972GG8JB-25 by Winbond Electronics Corp
Overview of W972GG8JB-25 by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for W972GG8JB-25
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 16 |
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RFQ | ||
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Velocity Electronics | Our Stock | 378 |
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RFQ |
Part Details for W972GG8JB-25
W972GG8JB-25 CAD Models
W972GG8JB-25 Part Data Attributes
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W972GG8JB-25
Winbond Electronics Corp
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Datasheet
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W972GG8JB-25
Winbond Electronics Corp
DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA60, WBGA-60
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Part Package Code | BGA | |
Package Description | TFBGA, BGA60,9X11,32 | |
Pin Count | 60 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | MULTI BANK PAGE BURST | |
Access Time-Max | 0.4 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B60 | |
JESD-609 Code | e1 | |
Length | 11.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR2 DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 60 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 256MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA60,9X11,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.012 A | |
Supply Current-Max | 0.2 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 11 mm |
Alternate Parts for W972GG8JB-25
This table gives cross-reference parts and alternative options found for W972GG8JB-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W972GG8JB-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MT47H256M8EB-25EAIT:C | DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA60, FBGA-60 | Micron Technology Inc | W972GG8JB-25 vs MT47H256M8EB-25EAIT:C |
MT47H256M8EB-25EIT:C | DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA60, 9 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | W972GG8JB-25 vs MT47H256M8EB-25EIT:C |
MT47H256M8EB-25E:A | DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA60, 9 X 12.5 M, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | W972GG8JB-25 vs MT47H256M8EB-25E:A |
MT47H256M8EB-25EAAT:C | DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA60, FBGA-60 | Micron Technology Inc | W972GG8JB-25 vs MT47H256M8EB-25EAAT:C |
MT47H256M8EB-25E:C | DDR DRAM, 256MX8, 0.4ns, CMOS, PBGA60, 9 X 11.50 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | W972GG8JB-25 vs MT47H256M8EB-25E:C |