-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for W9751G6NB25I by Winbond Electronics Corp
Overview of W9751G6NB25I by Winbond Electronics Corp
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Entertainment and Gaming
Price & Stock for W9751G6NB25I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
256-W9751G6NB25I-ND
|
DigiKey | IC DRAM 512MBIT PAR 84VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$1.7133 / $2.6700 | Buy Now |
|
DISTI #
454-W9751G6NB25I
|
Mouser Electronics | DRAM 512Mb DDR2-800, x16 Ind Temp | 0 |
|
$1.8800 / $2.6400 | Order Now |
|
DISTI #
V36:1790_24007283
|
Arrow Electronics | DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin VFBGA Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks Date Code: 2406 | Americas - 32 |
|
$1.9664 / $3.0738 | Buy Now |
|
DISTI #
79364227
|
Verical | DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin VFBGA Min Qty: 4 Package Multiple: 1 Date Code: 2406 | Americas - 32 |
|
$1.9664 / $3.0738 | Buy Now |
|
|
NAC | 512Mb DDR2-800, x16 Ind Temp, BGA84 Package RoHS: Compliant Min Qty: 209 Package Multiple: 209 | 0 |
|
$2.1400 / $2.2500 | Buy Now |
|
DISTI #
W9751G6NB25I
|
Avnet Asia | DRAM Chip DDR2 SDRAM 512Mbit 32M x 16 1.8V 84-Pin VFBGA (Alt: W9751G6NB25I) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 20 Weeks, 0 Days | 0 |
|
RFQ | |
|
|
Chip1Cloud | DDR2-800 32Mx16 (512Mb) Ind | 2447 |
|
RFQ |
Part Details for W9751G6NB25I
W9751G6NB25I CAD Models
W9751G6NB25I Part Data Attributes
|
|
W9751G6NB25I
Winbond Electronics Corp
Buy Now
Datasheet
|
Compare Parts:
W9751G6NB25I
Winbond Electronics Corp
DDR DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.008 A | |
| Supply Current-Max | 0.12 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |