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MT25QU01GBBB8E12-0SIT
Micron Technology Inc
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$17.4099 | Yes | Active | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 166 MHz | FLASH | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | QSPI | 2 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICRON TECHNOLOGY INC | TBGA-24 | compliant | EAR99 | 8542.32.00.51 | Micron | ||||||||||||||||||
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S25FL128SAGNFI001
Infineon Technologies AG
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$3.9438 | Yes | Active | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | INFINEON TECHNOLOGIES AG | compliant | Infineon | |||||||||||
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W25Q32JVSSIQ
Winbond Electronics Corp
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$0.6991 | Yes | Yes | Active | 33.5544 Mbit | 8 | 4MX8 | 3.3 V | 133 MHz | FLASH | 2.7V NOMINAL AVAILABLE WITH 104MHZ | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | SERIAL | 3 V | 3.6 V | 3 V | CMOS | INDUSTRIAL | S-PDSO-G8 | e3 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | compliant | EAR99 | 8542.32.00.51 | Winbond | |||||||||||||||||||||
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MT25QL02GCBB8E12-0SIT
Micron Technology Inc
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$32.6261 | Yes | Active | 2.1475 Gbit | 8 | 256MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 130 µA | 94 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | e1 | 85 °C | -40 °C | 260 | 30 | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICRON TECHNOLOGY INC | TBGA, | compliant | EAR99 | 8542.32.00.51 | Micron | |||||||||||||
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AT45DB641E-SHN2B-T
Adesto Technologies Corporation
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$4.0361 | Yes | Yes | Transferred | 67.1089 Mbit | 1 | 64MX1 | 2.3 V | 85 MHz | FLASH | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 1.8 V | 3.6 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G8 | e4 | 1 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.29 mm | 5.24 mm | ADESTO TECHNOLOGIES CORP | 0.208 INCH, GREEN, PLASTIC, SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | SOIC | 8 | |||||||||||||||||||
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S25FL256SAGNFI001
Infineon Technologies AG
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$5.0369 | Yes | Active | 268.4355 Mbit | 4 | 64MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | INFINEON TECHNOLOGIES AG | compliant | 3A991.B.1.A | 8542.32.00.51 | Infineon | 8 | |||||||||
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AT25DF081A-SSH-T
Adesto Technologies Corporation
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$1.4408 | Yes | Transferred | 8.3886 Mbit | 1 | 8MX1 | 3 V | 100 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 10 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.925 mm | 3.9 mm | ADESTO TECHNOLOGIES CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | SOIC | 8 | |||||||||||
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MT28EW01GABA1HJS-0SIT
Micron Technology Inc
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$13.5881 | Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 3 V | 95 ns | FLASH | 1 | 64000000 | 67.1089 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G56 | e3 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | MICRON TECHNOLOGY INC | TSOP-56 | compliant | EAR99 | 8542.32.00.51 | Micron | |||||||||||||||||||||
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MT25QU02GCBB8E12-0SIT
Micron Technology Inc
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$25.1323 | Yes | Active | 2.1475 Gbit | 8 | 256MX8 | 1.8 V | 166 MHz | FLASH | 100000 Write/Erase Cycles | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | QSPI | 2 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICRON TECHNOLOGY INC | TBGA-24 | compliant | EAR99 | 8542.32.00.51 | Micron | ||||||||||||||||||
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MT25QL512ABB8ESF-0SIT
Micron Technology Inc
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$8.2357 | Yes | Active | 536.8709 Mbit | 8 | 64MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 130 µA | 94 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | MICRON TECHNOLOGY INC | SOP-16 | compliant | EAR99 | 8542.32.00.51 | Micron |