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31 - 40 of 312,420 results
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MT28EW01GABA1HJS-0SIT
Micron Technology Inc
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$13.5881 | Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 3 V | 95 ns | FLASH | 1 | 64000000 | 67.1089 M | ASYNCHRONOUS | PARALLEL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | R-PDSO-G56 | e3 | 85 °C | -40 °C | 260 | 30 | 56 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | MICRON TECHNOLOGY INC | TSOP-56 | compliant | EAR99 | 8542.32.00.51 | Micron | |||||||||||||||||||||||||||||
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MT25QU02GCBB8E12-0SIT
Micron Technology Inc
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$25.1323 | Yes | Active | 2.1475 Gbit | 8 | 256MX8 | 1.8 V | 166 MHz | FLASH | 100000 Write/Erase Cycles | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | QSPI | 2 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICRON TECHNOLOGY INC | TBGA-24 | compliant | EAR99 | 8542.32.00.51 | Micron | ||||||||||||||||||||||||||
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MT25QL512ABB8ESF-0SIT
Micron Technology Inc
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$8.2357 | Yes | Active | 536.8709 Mbit | 8 | 64MX8 | 3 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 130 µA | 94 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | MICRON TECHNOLOGY INC | SOP-16 | compliant | EAR99 | 8542.32.00.51 | Micron | |||||||||||||||||||||||
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SST39VF3201C-70-4I-EKE
Microchip Technology Inc
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$2.8947 | Yes | Yes | Active | 33.5544 Mbit | 16 | 4K,32K | 2MX16 | 3 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 8,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 3 V | YES | 50 µA | 45 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 12 mm | MICROCHIP TECHNOLOGY INC | 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | TSOP1 | 48 | ||||||||
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AT45DB321E-SHF-T
Renesas Electronics Corporation
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$3.1989 | Yes | Yes | Active | 33.5544 Mbit | 1 | 32MX1 | 3 V | 85 MHz | FLASH | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e4 | 1 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.29 mm | 5.24 mm | RENESAS ELECTRONICS CORP | compliant | Renesas Electronics | SOIC-W | |||||||||||||||||||||||||||||||
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M25P40-VMN6TPB
Micron Technology Inc
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$0.5847 | Yes | Yes | Obsolete | 4.1943 Mbit | 8 | 512KX8 | 2.7 V | 50 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 512000 | 524.288 k | SYNCHRONOUS | SERIAL | 3 V | SPI | 10 µA | 15 µA | 3.6 V | 2.3 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICRON TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Micron | SOIC | 8 | |||||||||||||||||||
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W25Q128FVSIG
Winbond Electronics Corp
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$1.6373 | Yes | Yes | Obsolete | 134.2177 Mbit | 1 | 128MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Winbond | SOIC | 8 | ||||||||||||||||||||
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AT45DB161D-SU
Adesto Technologies Corporation
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 1 | 16MX1 | 3 V | 66 MHz | FLASH | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 2.7 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDSO-G8 | e3 | 1 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.29 mm | 5.24 mm | ADESTO TECHNOLOGIES CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Adesto Technologies | SOIC | 8 | ||||||||||||||||||||||||||||
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AT45DB161D-SU
Atmel Corporation
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Check for Price | Yes | Obsolete | 16.7772 Mbit | 1 | 16MX1 | 3 V | 66 MHz | FLASH | ORGANIZED AS 4096 PAGES OF 528 BYTES EACH | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 25 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.29 mm | 5.24 mm | ATMEL CORP | 0.209 INCH, GREEN, PLASTIC, EIAJ, SOIC-8 | unknown | EAR99 | 8542.32.00.51 | Microchip | SOIC | 8 | |||||||||||||||||
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S25FL128SAGNFI001
Cypress Semiconductor
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$4.0407 | Yes | Transferred | 134.2177 Mbit | 4 | 32MX4 | 3 V | 133 MHz | FLASH | IT ALSO CONFIGURED AS 256M X 1 | 2 | BOTTOM | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.1.A | 8542.32.00.51 |