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package
UPD23C16000BLGY-XXX-MKH
 NEC Electronics Group 		Check for Price Obsolete 65.536 kbit 8 8KX8 5 V 90 ns MASK ROM 8 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 30 µA 5.5 V 4.5 V MOS COMMERCIAL R-PDSO-G48 Not Qualified e0 70 °C -10 °C 48 PLASTIC/EPOXY TSOP1-R RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 16.4 mm 12 mm TSOP1 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 48 EAR99 8542.32.00.71
package
HN62W428FB
 Hitachi Ltd 		Check for Price Transferred 8.3886 Mbit 8 1MX8 5 V 300 ns MASK ROM 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 5.5 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 3 mm 28.5 mm 12.6 mm SOIC PLASTIC, SOP-44 44 EAR99 8542.32.00.71
package
AM27X2048-90JI
 AMD 		Check for Price Obsolete 2.0972 Mbit 16 128KX16 5 V 90 ns MASK ROM 1 128000 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 50 µA 5.5 V 4.5 V CMOS INDUSTRIAL S-PQCC-J44 Not Qualified e0 2 85 °C -40 °C 44 PLASTIC/EPOXY QCCJ LDCC44,.7SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD LCC PLASTIC, LCC-44 44 EAR99 8542.32.00.71
HB1831C-H-000
 Hughes Aircraft 		Check for Price Obsolete 2.0972 Mbit 8 256KX8 5 V 140 ns MASK ROM 1 512 512 words SYNCHRONOUS SERIAL 25 µA CMOS MILITARY X-XUUC-N23 Not Qualified 125 °C -55 °C 23 UNSPECIFIED UNSPECIFIED UNCASED CHIP YES NO LEAD UPPER DIE-23 EAR99 8542.32.00.71
package
K3N3C1000D-DC100
 Samsung Semiconductor 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 5 V 100 ns MASK ROM 8 1 256000 262.144 k ASYNCHRONOUS PARALLEL 50 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T40 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 40 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.08 mm 52.43 mm 15.24 mm DIP 0.600 INCH, DIP-40 40 EAR99 8542.32.00.71
MAT3864T60FD
 Dynex Semiconductor 		Check for Price Obsolete 4.1943 Mbit 8 512KX8 5 V 200 ns MASK ROM RADIATION HARD CMOS/SILICON ON SAPPHIRE ... more 1 8000 8.192 k ASYNCHRONOUS 3-STATE PARALLEL 10 µA 5.5 V 4.5 V CMOS MILITARY R-CDFP-F28 Not Qualified 125 °C -55 °C 28 CERAMIC, METAL-SEALED COFIRED DFP RECTANGULAR FLATPACK YES FLAT DUAL , EAR99 8542.32.00.71 Unknown
package
HN62418FP
 Hitachi Ltd 		Check for Price Transferred 8.3886 Mbit 8 1MX8 5 V 150 ns MASK ROM 16 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL S-PQFP-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 800 µm QUAD 3.05 mm 14 mm 14 mm QFP PLASTIC, QFP-44 44 EAR99 8542.32.00.71
package
K3P6U1000D-YE
 Samsung Semiconductor 		Check for Price Obsolete 33.5544 Mbit 16 2MX16 3 V 100 ns MASK ROM 8 1 2000000 2.0972 M ASYNCHRONOUS PARALLEL 60 µA 3.3 V 2.7 V CMOS OTHER R-PDSO-G48 Not Qualified 85 °C -20 °C 48 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 500 µm DUAL 1.2 mm 16.4 mm 12 mm TSOP1 12 X 18 MM, TSOP1-48 48 EAR99 8542.32.00.71
package
MX23C4000MC-15
 Macronix International Co Ltd 		Check for Price Obsolete 4.1943 Mbit 8 512KX8 5 V 150 ns MASK ROM 1 512000 524.288 k ASYNCHRONOUS 3-STATE PARALLEL 100 µA 40 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified e0 70 °C -10 °C 32 PLASTIC/EPOXY SOP SOP32,.56 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3 mm 20.45 mm 11.3 mm SOIC 0.450 INCH, MO-099, SOP-32 32 EAR99 8542.32.00.71
package
MR27V1602F-XXXMA
 LAPIS Semiconductor Co Ltd 		Check for Price Obsolete 16.7772 Mbit 16 1MX16 3.3 V 80 ns MASK ROM 8 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 10 µA 30 µA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G44 Not Qualified 70 °C 44 PLASTIC/EPOXY SOP SOP44,.63 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 3.1 mm 28.15 mm 13 mm SOIC 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 44 EAR99 8542.32.00.71
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