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MCM72F9DG12
Motorola Mobility LLC
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Check for Price | Obsolete | 37.7487 Mbit | 72 | 512KX72 | 3.3 V | 12 ns | SRAM MODULE | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 1 | 512000 | 524.288 k | SYNCHRONOUS | 3-STATE | YES | PARALLEL | 3.14 V | 2.24 mA | 3.6 V | 3.135 V | BICMOS | COMMERCIAL | R-XDMA-N168 | Not Qualified | 70 °C | 168 | UNSPECIFIED | DIMM | DIMM168 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.27 mm | DUAL | MOTOROLA INC | DIMM | DIMM, DIMM168 | 168 | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||
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10474S7Y
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 4.096 kbit | 4 | 1KX4 | 7 ns | STANDARD SRAM | SEPARATE | 1 | 1000 | 1.024 k | ASYNCHRONOUS | OPEN-EMITTER | PARALLEL | BICMOS | COMMERCIAL EXTENDED | R-PDSO-J24 | Not Qualified | e0 | 3 | 75 °C | 225 | 30 | 24 | PLASTIC/EPOXY | SOJ | SOJ24,.34 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | DUAL | 3.7592 mm | 15.875 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | 0.300 INCH, 0.050 INCH PITCH, PLASTIC, MO-065AA, SOJ-24 | not_compliant | EAR99 | 8542.32.00.41 | |||||||||||||||
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MCM69P618CTQ5
NXP Semiconductors
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Check for Price | Obsolete | 1.1796 Mbit | 18 | 64KX18 | 3.3 V | 5 ns | CACHE SRAM | 1 | 64000 | 65.536 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | BICMOS | COMMERCIAL | R-PQFP-G100 | 70 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | NXP SEMICONDUCTORS | LQFP, | unknown | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||||||||||
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CY7M194-10DC
Cypress Semiconductor
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Check for Price | No | Obsolete | 262.144 kbit | 4 | 64KX4 | 5 V | 10 ns | SRAM MODULE | COMMON | 1 | 1 | 64000 | 65.536 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 200 mA | 4.5 V | 325 µA | 5.5 V | 4.5 V | BICMOS | COMMERCIAL | R-XDMA-T24 | Not Qualified | e0 | 70 °C | 24 | UNSPECIFIED | DIP | DIP24,.3 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | CYPRESS SEMICONDUCTOR CORP | compliant | EAR99 | 8542.32.00.41 | |||||||||||||||
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MCM69R820CZP6
Freescale Semiconductor
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Check for Price | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 3 ns | LATE-WRITE SRAM | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | BICMOS | COMMERCIAL | R-PBGA-B119 | Not Qualified | 70 °C | 119 | PLASTIC/EPOXY | BGA | RECTANGULAR | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 2.4 mm | 22 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | BGA | BGA, | 119 | unknown | 3A991 | 8542.31.00.01 | ||||||||||||||||||||
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MCM69F618CTQ7.5R
Freescale Semiconductor
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Check for Price | Transferred | 1.1796 Mbit | 18 | 64KX18 | 3.3 V | 7.5 ns | CACHE SRAM | 1 | 64000 | 65.536 k | SYNCHRONOUS | PARALLEL | 3.6 V | 3.135 V | BICMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | 70 °C | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | FREESCALE SEMICONDUCTOR INC | QFP | LQFP, | 100 | unknown | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||||||
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SCM6929WJ8C
Motorola Mobility LLC
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Check for Price | Obsolete | 1.0486 Mbit | 4 | 256KX4 | 3.3 V | 8 ns | STANDARD SRAM | 1 | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 3.6 V | 3.135 V | BICMOS | INDUSTRIAL | R-PDSO-J32 | Not Qualified | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | SOJ | RECTANGULAR | SMALL OUTLINE | YES | J BEND | 1.27 mm | DUAL | 3.75 mm | 20.96 mm | 10.16 mm | MOTOROLA INC | SOJ | SOJ, | 32 | unknown | 3A991.B.2.B | 8542.32.00.41 | ||||||||||||||||
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WS512K32NBV-20H2MEA
White Electronic Designs Corp
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Check for Price | No | Obsolete | 16.7772 Mbit | 8 | 2MX8 | 3.3 V | 20 ns | SRAM MODULE | CONFIGURABLE AS 1M X 16 OR 512K X 32 | COMMON | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 480 µA | 3.6 V | 3 V | BICMOS | MILITARY | S-CPGA-P66 | Not Qualified | e0 | 125 °C | -55 °C | 66 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA66,11X11 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.7 mm | 35.2 mm | 35.2 mm | WHITE ELECTRONIC DESIGNS CORP | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | unknown | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||
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HM6709AJP-15
Renesas Electronics Corporation
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Check for Price | Transferred | 262.144 kbit | 4 | 64KX4 | 5 V | 15 ns | STANDARD SRAM | 1 | 64000 | 65.536 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | BICMOS | COMMERCIAL | R-PDSO-J28 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SOJ | RECTANGULAR | SMALL OUTLINE | YES | J BEND | 1.27 mm | DUAL | 3.76 mm | 18.17 mm | 7.62 mm | RENESAS TECHNOLOGY CORP | SOJ | SOJ, | 28 | unknown | EAR99 | 8542.32.00.41 | ||||||||||||||||||||
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IDT7MP4045S10M
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 8.3886 Mbit | 8 | 1MX8 | 5 V | 10 ns | SRAM MODULE | CONFIGURABLE AS 256K X 32 | 16 | COMMON | 1 | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 320 mA | 4.5 V | 1.6 mA | 5.5 V | 4.5 V | BICMOS | COMMERCIAL | R-XSMA-N64 | Not Qualified | 1 | 70 °C | 64 | UNSPECIFIED | SIMM | SSIM64 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | NO LEAD | 1.27 mm | SINGLE | 16.002 mm | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | 3A991.B.2.A | 8542.32.00.41 |