Parametric results for: L64500AGMC under Microprocessors

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EFR32FG22C121F512GM32-C
Silicon Laboratories Inc
$2.1931 Active MICROPROCESSOR, RISC 8542.31.00.30
SAM9X60-V/6GW
Microchip Technology Inc
$2.9900 Active MICROPROCESSOR, RISC 8542.31.00.30 256 TFBGA-256
S9S08RN32W1MLF
NXP Semiconductors
$3.2700 Yes Active 8 20 MHz 4096 20 MHz YES 3 V MICROPROCESSOR CMOS NO FIXED POINT NO YES 16 3 8 14.8 mA 5.5 V 2.7 V AUTOMOTIVE S-PQFP-G48 e3 3 125 °C -40 °C 260 40 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 7 mm 7 mm 8542.31.00.01 LQFP-48 3A991.A.2
S9S08RN48W1MLC
NXP Semiconductors
$3.3800 Yes Active 8 20 MHz 4096 20 MHz YES 3 V MICROPROCESSOR CMOS NO FIXED POINT NO YES 12 2 8 14.8 mA 5.5 V 2.7 V AUTOMOTIVE S-PQFP-G32 e3 3 125 °C -40 °C 260 40 32 PLASTIC/EPOXY LQFP QFP32,.35SQ,32 SQUARE FLATPACK, LOW PROFILE Tin (Sn) GULL WING 800 µm QUAD 1.6 mm 7 mm 7 mm 8542.31.00.01 LQFP-32 3A991.A.2
package
NHPXA270C5C520
Intel Corporation
$3.4208 Yes Transferred 32 520 MHz 32 26 3.6864 MHz YES 1.45 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.595 V 1.3775 V S-PBGA-B360 Not Qualified e1 360 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL BOTTOM 8542.31.00.25 360 23 X 23 MM, 2.4 MM PITCH, PLASTIC, LEAD FREE, BGA-360 BGA
S9S08RN32W1MLH
NXP Semiconductors
$3.4550 Yes Active 8 20 MHz 4096 20 MHz YES 3 V MICROPROCESSOR CMOS NO FIXED POINT NO YES 16 3 8 14.8 mA 5.5 V 2.7 V AUTOMOTIVE S-PQFP-G64 e3 3 125 °C -40 °C 260 40 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm 8542.31.00.01 LQFP-64 3A991.A.2
S9S08RN48W1MLCR
NXP Semiconductors
$3.5250 Yes Active MICROPROCESSOR e3 3 260 40 Tin (Sn) 8542.31.00.01 3A991.A.2
S9S08RN48W1MLF
NXP Semiconductors
$3.5250 Yes Active 8 20 MHz 4096 20 MHz YES 3 V MICROPROCESSOR CMOS NO FIXED POINT NO YES 16 3 8 14.8 mA 5.5 V 2.7 V AUTOMOTIVE S-PQFP-G48 e3 3 125 °C -40 °C 260 40 48 PLASTIC/EPOXY LFQFP QFP48,.35SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 7 mm 7 mm 8542.31.00.01 LQFP-48 3A991.A.2
S9S08RN48W1MLH
NXP Semiconductors
$3.7100 Yes Active 8 20 MHz 4096 20 MHz YES 3 V MICROPROCESSOR CMOS NO FIXED POINT NO YES 16 3 8 14.8 mA 5.5 V 2.7 V AUTOMOTIVE S-PQFP-G64 e3 3 125 °C -40 °C 260 40 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm 8542.31.00.01 LQFP-64 3A991.A.2
SAM9X60-V/DWB
Microchip Technology Inc
$3.7442 Yes Active 32 600 MHz 69632 32 26 48 MHz YES 1.15 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 16 8 14 mA 1.21 V 1.02 V INDUSTRIAL S-PBGA-B228 105 °C -40 °C 228 PLASTIC/EPOXY TFBGA BGA228,16X16,25 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH BALL 650 µm BOTTOM 1.2 mm 11 mm 11 mm 8542.31.00.01 228 TFBGA-228 TFBGA-228 5A992.C 2019-09-24