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Parametric results for: Telecom Signaling Circuits

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MT8888CP1
 Microsemi Corporation 		$5.3065 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 INDUSTRIAL S-PQCC-J28 e3 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MICROSEMI CORP QLCC LEAD FREE, PLASTIC, LCC-28 28 compliant 8542.39.00.01 Microsemi Corporation
MT8880CP1
 Microsemi Corporation 		$5.3065 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 INDUSTRIAL S-PQCC-J28 e3 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MICROSEMI CORP LCC LEAD FREE, PLASTIC, MS-018AB, LCC-28 28 compliant 8542.39.00.01 Microsemi Corporation
MT8880CN1
 Microsemi Corporation 		$5.3065 Yes No Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP SSOP 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 24 unknown 8542.39.00.01 Microsemi Corporation
MT8889CS1
 Microsemi Corporation 		$5.6782 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 10 mA INDUSTRIAL R-PDSO-G20 e3 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY SOP SOP20,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 12.8 mm 2.65 mm MICROSEMI CORP SOIC 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 20 unknown 8542.39.00.01 Microsemi Corporation
MT8889CN1
 Microsemi Corporation 		$5.9605 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP SSOP 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 24 compliant 8542.39.00.01 Microsemi Corporation
MT3371BS1
 Zarlink Semiconductor Inc 		Check for Price Yes Transferred 5 V DTMF SIGNALING CIRCUIT 1 8 µA INDUSTRIAL R-PDSO-G18 e3 Not Qualified 3 85 °C -40 °C 260 18 PLASTIC/EPOXY SOP SOP18,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 11.55 mm 2.65 mm ZARLINK SEMICONDUCTOR INC 0.300 INCH, LEAD FREE, MS-013AB, SOIC-18 compliant 8542.39.00.01
MB87057-M
 FUJITSU Semiconductor Limited 		Check for Price No Active 5 V DTMF SIGNALING CIRCUIT 1 COMMERCIAL R-PDSO-G24 e0 Not Qualified 70 °C 24 PLASTIC/EPOXY SOP SOP24,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL FUJITSU LTD SOP, SOP24,.4 compliant 8542.39.00.01
M-8880-01SMTR
 Industrial Defender Inc 		Check for Price Transferred 5 V DTMF SIGNALING CIRCUIT 1 15 mA INDUSTRIAL R-PDSO-G20 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES GULL WING DUAL TELTONE CORP , unknown 8542.39.00.01
AMS3201P
 Williams Controls 		Check for Price No No Contact Manufacturer 12 V CMOS DTMF SIGNALING CIRCUIT 1 20 mA COMMERCIAL R-PDIP-T22 e0 Not Qualified 70 °C 22 PLASTIC/EPOXY DIP DIP22,.4 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL APTEK WILLIAMS INC DIP, DIP22,.4 unknown 8542.39.00.01
BU8874F-DXE1
 ROHM Semiconductor 		Check for Price Yes Yes Active 5 V CMOS DTMF SIGNALING CIRCUIT 1 3.4 mA R-PDSO-G18 e3/e2 Not Qualified 260 10 18 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN/TIN COPPER GULL WING 1.27 mm DUAL 5.4 mm 11.2 mm 1.9 mm ROHM CO LTD SOIC SOP-18 18 compliant 8542.39.00.01
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