Parametric results for: 1N4625 BARE DIE under Zener Diodes
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1N4625-1
Microsemi Corporation
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$2.6210 | No | Transferred | 250 µA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435F | DO-204AH | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | Microsemi Corporation | ||||||||||
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1N4625
Microchip Technology Inc
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$2.7117 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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1N4625-1
Microchip Technology Inc
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$2.7217 | No | Active | 250 µA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435F | DO-204AH | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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1N4625-1/TR
Microchip Technology Inc
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$2.8917 | No | Active | 250 µA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e0 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||||
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1N4625-1E3
Microchip Technology Inc
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$2.8917 | Yes | Active | 250 µA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 kΩ | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-204AH | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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1N4625-1E3
Microsemi Corporation
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$2.9137 | Yes | Yes | Transferred | 250 µA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1.5 kΩ | 5 % | Not Qualified | O-LALF-W2 | e3 | DO-204AH | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROSEMI CORP | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | DO-35 | 2 | EAR99 | 8541.10.00.50 | ||||||
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1N4625-1E3/TR
Microchip Technology Inc
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$3.1409 | Yes | Active | 250 µA | 480 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | O-LALF-W2 | e3 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | ROHS COMPLIANT, HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||||
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1N4625UR
Microsemi Corporation
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$3.3994 | No | No | Transferred | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 1.5 kΩ | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MLL34, MELF-2 | not_compliant | DO-213AA | 2 | EAR99 | 8541.10.00.50 | |||||
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JANTX1N4625-1
Microchip Technology Inc
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$4.1408 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||
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JAN1N4625-1
Microchip Technology Inc
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$4.2628 | No | Active | 250 µA | 500 mW | 5.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |