Parametric results for: 1N749A under Zener Diodes
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1N749A
SPC Multicomp
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$0.0172 | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY | 5 % | O-LALF-W2 | DO-35 | 200 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MULTICOMP PRO | GLASS PACAKGE-2 | unknown | EAR99 | 8541.10.00.50 | |||||||||||||||||
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1N749A
Microsemi Corporation
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$2.0202 | No | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 18 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.50 | DO-7 | 2 | Microsemi Corporation | ||||||||
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1N749A-1
Microsemi Corporation
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$2.0202 | No | No | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||||
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JAN1N749A-1
Microchip Technology Inc
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$2.1118 | No | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||||
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1N749A-1
Microchip Technology Inc
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$2.2218 | No | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||||
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JANTX1N749A-1
Microchip Technology Inc
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$2.3524 | No | Active | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||
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JANTX1N749A-1/TR
Microchip Technology Inc
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$2.4974 | No | Active | 90 mA | 2 µA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 18 Ω | 1 V | 0.86 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | ||||||||||
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1N749AUR-1
Microsemi Corporation
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$2.9526 | No | No | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MELF-2 | unknown | EAR99 | 8541.10.00.50 | DO-213AA | 2 | |||||||||||
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1N749AUR-1
Microchip Technology Inc
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$3.1159 | No | Active | 20 mA | 2 µA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 18 Ω | 1 V | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | Microchip | |||||||||||
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JANTX1N749A-1
Microsemi Corporation
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$4.0422 | No | No | Transferred | 20 mA | 500 mW | 4.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | not_compliant | EAR99 | 8541.10.00.50 | DO-35 | 1 | Microsemi Corporation |