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NMC0603X7R105K6.3TRPF
NIC Components Corp
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$0.0041 | Yes | Yes | Active | 1 µF | 6.3 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | SMT | TR, PUNCHED PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1 mm | 1.6 mm | 800 µm | NIC COMPONENTS CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | |||||||
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NMC0402X5R105K10TRPF
NIC Components Corp
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$0.0055 | Yes | Yes | Active | 1 µF | 10 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PUNCHED PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 600 µm | 1 mm | 500 µm | NIC COMPONENTS CORP | , 0402 | compliant | EAR99 | 8532.24.00.20 | ||||||
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CL05X105KQ5NNNC
Samsung Electro-Mechanics
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$0.0058 | Yes | Yes | Active | 1 µF | 6.3 V | 10 % | 0402 | X6S | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 105 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 550 µm | 1 mm | 500 µm | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | 0402 | |||||
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NMC0402X5R105K16TRPF
NIC Components Corp
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$0.0058 | Yes | Yes | Active | 1 µF | 16 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PUNCHED PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 600 µm | 1 mm | 500 µm | NIC COMPONENTS CORP | , 0402 | compliant | EAR99 | 8532.24.00.20 | ||||||
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C1005X6S1A105K050BC
TDK Corporation
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$0.0058 | Yes | Yes | Active | 1 µF | 10 V | 10 % | 0402 | X6S | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 22% ppm/°C | e3 | 105 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 Inch | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||||
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NMC0603X5R105K25TRP4KF
NIC Components Corp
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$0.0060 | Yes | Active | 1 µF | 25 V | 10 % | 0603 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | NIC COMPONENTS CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 | ||||||||||||
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MC0603B105K160CT
SPC Multicomp
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$0.0060 | Yes | Active | 1 µF | 16 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, PAPER, 7 INCH | YES | TIN OVER NICKEL | WRAPAROUND | SPC TECHNOLOGY/ MULTICOMP | , 0603 | unknown | EAR99 | 8532.24.00.20 | |||||||||||
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MC0603F105Z160CT
SPC Multicomp
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$0.0063 | Yes | Yes | Active | 1 µF | 16 V | 80 % | 0603 | Y5V | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | -82/+22% ppm/°C | 85 °C | -30 °C | 2 | RECTANGULAR PACKAGE | TR, 7 INCH | YES | WRAPAROUND | SPC TECHNOLOGY/ MULTICOMP | , 0603 | unknown | EAR99 | 8532.24.00.20 | ||||||||||||
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LMF107B7105KAHT
TAIYO YUDEN
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$0.0065 | Yes | Not Recommended | 1 µF | 10 V | 10 % | 0603 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 0.1 | 15% ppm/°C | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | WRAPAROUND | 800 µm | 1.6 mm | 800 µm | TAIYO YUDEN CO LTD | , 0603 | unknown | EAR99 | 8532.24.00.20 | TAIYO YUDEN | ||||||
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NMC0603Y5V105Z10TRPF
NIC Components Corp
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$0.0067 | Yes | Yes | Active | 1 µF | 10 V | 80 % | 0603 | Y5V | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | -82/+22% ppm/°C | e3 | 85 °C | -30 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PUNCHED PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 1 mm | 1.6 mm | 800 µm | NIC COMPONENTS CORP | , 0603 | compliant | EAR99 | 8532.24.00.20 |