Parametric results for: 24LC256-I%2FSM under EEPROMs
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24LC256-I/SNG
Microchip Technology Inc
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$0.7399 | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | NO | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||
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24LC256-I/MS
Microchip Technology Inc
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$0.8425 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 8 | PLASTIC/EPOXY | SOP | SOP8,.19 | SQUARE | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | MSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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24LC256-I/SMG
Microchip Technology Inc
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$0.8569 | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 3.6 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 1.5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.03 mm | 5.26 mm | 5.25 mm | MICROCHIP TECHNOLOGY INC | SOIC | SOIJ-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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24LC256-I/ST
Microchip Technology Inc
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$0.9388 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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24LC256-I/SN
Microchip Technology Inc
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$0.9423 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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24LC256-I/SM
Microchip Technology Inc
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$0.9425 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 1.5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 2.03 mm | 5.26 mm | 5.25 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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24LC256-I/P
Microchip Technology Inc
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$0.9536 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||
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24LC256-I/MF
Microchip Technology Inc
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$1.0399 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 1.27 mm | DUAL | 1 mm | 6 mm | 5 mm | MICROCHIP TECHNOLOGY INC | DFN | DFN-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||
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24LC256-I/PG
Microchip Technology Inc
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$1.3500 | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | 4.5 V | I2C | 1.5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | PDIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||
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24LC256-I/STG
Microchip Technology Inc
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$1.4716 | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | NO | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | TSSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip |