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5962-8606301XA
LSI Corporation
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | SEEQ TECHNOLOGY INC | DIP | WDIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||
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5962-8606301XA
AMD
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | WDIP | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | NO | Tin/Lead (Sn/Pb) - hot dipped | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | ADVANCED MICRO DEVICES INC | DIP | WDIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||
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5962-8606301XA
QP Semiconductor
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Check for Price | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | QP SEMICONDUCTOR INC | DIP | DIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||||||
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5962-8606301XA
Micross Components
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 28 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.8928 mm | 15.24 mm | MICROSS COMPONENTS | DIP | DIP, DIP28,.6 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | ||||
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5962-8606301XA
Atmel Corporation
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.25 mm | 15.24 mm | ATMEL CORP | DIP | WDIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||
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5962-8606301XA
Texas Instruments
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 28 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | DUAL | TEXAS INSTRUMENTS INC | DIP | DIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||||
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5962-8606301XA
NXP Semiconductors
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 25 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.588 mm | 37.1475 mm | 15.24 mm | NXP SEMICONDUCTORS | DIP | WDIP, | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 | |||||||||
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5962-8606301XA
Teledyne e2v
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Check for Price | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | TELEDYNE E2V (UK) LTD | DIP | CERAMIC, DIP-28 | 28 | compliant | 3A001.A.2.C | 8542.32.00.61 | ||||||
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5962-8606301XA
Waferscale Integration Inc
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Check for Price | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 40 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | 28 | CERAMIC, GLASS-SEALED | WDIP | RECTANGULAR | IN-LINE, WINDOW | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 5.72 mm | 37.215 mm | 15.24 mm | WAFERSCALE INTEGRATION INC | 0.600 INCH, WINDOWED, CERDIP-28 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||||||||||
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5962-8606301XA
Intel Corporation
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Check for Price | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 200 ns | UVPROM | COMMON | 1 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 12.5 V | 300 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-GDIP-T28 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | INTEL CORP | DIP | DIP, DIP28,.6 | 28 | unknown | 3A001.A.2.C | 8542.32.00.61 |