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IDT6167LA55LB
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 55 ns | STANDARD SRAM | SEPARATE | 1 | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 200 µA | 2 V | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N20 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 20 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC20,.3X.43 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1.905 mm | 10.8585 mm | 7.366 mm | QLCC | 0.300 INCH, LCC-20 | 20 | 3A001.a.2.c | 8542.32.00.41 | |||||
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6167LA55LB
Integrated Device Technology Inc
|
Check for Price | No | Obsolete | 16.384 kbit | 1 | 16KX1 | 5 V | 55 ns | STANDARD SRAM | SEPARATE | 1 | 16000 | 16.384 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 200 µA | 2 V | 60 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CQCC-N20 | Not Qualified | e0 | 1 | 125 °C | -55 °C | 260 | MIL-STD-883 Class B | 20 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC20,.3X.43 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 1.905 mm | 10.8585 mm | 7.366 mm | LCC | 0.300 INCH, LCC-20 | 20 | 3A001.a.2.c | 8542.32.00.41 | LZ20 |