Parametric results for: 70v9169 under SRAMs

Filter Your Search

1 - 10 of 56 results

|
-
-
-
-
-
Manufacturer Part Number: 70v9169
Select parts from the table below to compare.
Compare
Compare
70V9169L6PFG8
Integrated Device Technology Inc
$22.7435 Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 15 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP TQFP-100 100 PNG100 compliant EAR99 8542.32.00.41
70V9169L7PFGI8
Integrated Device Technology Inc
$22.7435 Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 18 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS INDUSTRIAL S-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP TQFP-100 100 PNG100 compliant EAR99 8542.32.00.41
70V9169L7PFGI
Integrated Device Technology Inc
$28.8231 Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 18 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS INDUSTRIAL S-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP TQFP-100 100 PNG100 compliant EAR99 8542.32.00.41
70V9169L6PFG
Integrated Device Technology Inc
$28.8231 Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 15 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP TQFP-100 100 PNG100 compliant EAR99 8542.32.00.41
70V9169L6BF
Integrated Device Technology Inc
Check for Price No No Obsolete 147.456 kbit 9 16KX9 3.3 V 6.5 ns 100 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 3 mA 3 V 330 µA 3.6 V 3 V CMOS COMMERCIAL S-PBGA-B100 Not Qualified e0 3 70 °C 240 20 100 PLASTIC/EPOXY LFBGA BGA100,10X10,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.4 mm 10 mm 10 mm INTEGRATED DEVICE TECHNOLOGY INC CABGA 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 100 BF100 not_compliant EAR99 8542.32.00.41
IDT70V9169L7PFGI
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 18 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS INDUSTRIAL S-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, 100 compliant EAR99 8542.32.00.41
70V9169L6PF8
Integrated Device Technology Inc
Check for Price No No Obsolete 147.456 kbit 9 16KX9 3.3 V 15 ns 100 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 3 mA 3 V 330 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e0 3 70 °C 240 20 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 100 PN100 not_compliant EAR99 8542.32.00.41
IDT70V9169L9PF8
Integrated Device Technology Inc
Check for Price No No Obsolete 147.456 kbit 9 16KX9 3.3 V 20 ns 66.7 MHz MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE PARALLEL 3 mA 3 V 230 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e0 3 70 °C 240 20 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Tin/Lead (Sn85Pb15) GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 100 not_compliant EAR99 8542.32.00.41
70V9169L6PFG
Renesas Electronics Corporation
Check for Price Yes Yes Obsolete 147.456 kbit 9 16KX9 3.3 V 6.5 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE COMMON 1 2 16000 16.384 k SYNCHRONOUS 3-STATE YES PARALLEL 3 mA 3 V 330 µA 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES MATTE TIN GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm RENESAS ELECTRONICS CORP TQFP TQFP-100 100 PNG100 compliant NLR 8542320041 Renesas Electronics
IDT70V9169L7PFG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 147.456 kbit 9 16KX9 3.3 V 18 ns MULTI-PORT SRAM FLOW-THROUGH OR PIPELINED ARCHITECTURE 1 16000 16.384 k SYNCHRONOUS PARALLEL 3.6 V 3 V CMOS COMMERCIAL S-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES Matte Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LFQFP, 100 compliant EAR99 8542.32.00.41