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Manufacturer Part Number: 71v67603s150pfgi
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71V67603S150PFGI8
 Integrated Device Technology Inc 		$19.2893 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V67603S150PFGI
 Integrated Device Technology Inc 		$21.2897 Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-136BX, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
IDT71V67603S150PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns CACHE SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
IDT71V67603S150PFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns CACHE SRAM PIPELINED ARCHITECTURE 1 256000 262.144 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
71V67603S150PFGI
 Renesas Electronics Corporation 		Check for Price Yes Yes Active 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
71V67603S150PFGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes End Of Life 9.4372 Mbit 36 256KX36 3.3 V 3.8 ns 150 MHz STANDARD SRAM PIPELINED ARCHITECTURE COMMON 1 256000 262.144 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 325 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics