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72T72115L5BBI
Integrated Device Technology Inc
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$177.8450 | No | No | Transferred | 9.4372 Mbit | 72 | 128KX72 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | ASYNCHRONOUS OPERATION ALSO POSSIBLE | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 50 mA | 60 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | PBGA | BGA-324 | 324 | BB324 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT72T72115L5BBI
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 9.4372 Mbit | 72 | 128KX72 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | ASYNCHRONOUS OPERATION ALSO POSSIBLE | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 50 mA | 60 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | BGA, BGA324,18X18,40 | 324 | not_compliant | EAR99 | 8542.32.00.71 | ||||
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72T72115L5BBI
Renesas Electronics Corporation
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Check for Price | No | No | End Of Life | 9.4372 Mbit | 72 | 128KX72 | 2.5 V | 3.6 ns | 200 MHz | 5 ns | OTHER FIFO | ASYNCHRONOUS OPERATION ALSO POSSIBLE | 1 | 128000 | 131.072 k | SYNCHRONOUS | YES | PARALLEL | 50 mA | 60 µA | 2.625 V | 2.375 V | CMOS | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.97 mm | 19 mm | 19 mm | RENESAS ELECTRONICS CORP | PBGA | 324 | BB324 | not_compliant | NLR | 8542320071 | Renesas Electronics |