Parametric results for: FS159 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Device Socket Type Device Type Used On Housing Material JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 15

27 hits Apply

1.6 inch 27

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0.095 inch 3 0.12 inch 3 0.13 inch 3 0.165 inch 18

Min (inch) - Max (inch)

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1.6 inch 27

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16X16 27

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AU ON NI 15 NOT APPLICABLE 1 SN-PB ON NI 11

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Gold (Au) - with Nickel (Ni) barrier 11 TIN LEAD OVER NICKEL 1 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 15

27 hits Apply

Contact Material (2)

BE-CU 26 BRASS 1

27 hits Apply

RND PIN-SKT 27

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IC SOCKET 27

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PGA159 27

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GLASS FILLED EPOXY 27

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e0 16 e4 11

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Manufacturer (1)

Advanced Interconnections Corp 27

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0.1 inch 27

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STRAIGHT 27

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Number of Contacts (1)

159 27

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140.0 °C 15

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RECTANGULAR 27

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100 µm 27

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Obsolete 27

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Yes 8

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Terminal Pitch (1)

2.54 mm 27

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SOLDER 27

27 hits Apply