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Manufacturer Part Number: idt71v67902s
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IDT71V67902S85BQGI
 Integrated Device Technology Inc 		Check for Price Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 165 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA TBGA, 165 unknown 3A991.B.2.A 8542.32.00.41
IDT71V67902S80PFGI
 Integrated Device Technology Inc 		Check for Price Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 unknown 3A991.B.2.A 8542.32.00.41
IDT71V67902S75PF8
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns 117 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 265 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e0 3 70 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67902S75PFI
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns 117 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 285 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67902S80BGG
 Integrated Device Technology Inc 		Check for Price Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified 70 °C NOT SPECIFIED NOT SPECIFIED 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 unknown 3A991.B.2.A 8542.32.00.41
IDT71V67902S85BG8
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 50 mA 3.14 V 190 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 3 70 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67902S80B
 Integrated Device Technology Inc 		Check for Price Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns CACHE SRAM FLOW-THROUGH ARCHITECTURE 1 512000 524.288 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PBGA-B119 Not Qualified e0 70 °C 119 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA BGA, 119 unknown 3A991.B.2.A 8542.32.00.41
IDT71V67902S75BQI
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 7.5 ns 117 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 285 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B165 Not Qualified e0 3 85 °C -40 °C 225 30 165 PLASTIC/EPOXY TBGA BGA165,11X15,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN LEAD BALL 1 mm BOTTOM 1.2 mm 15 mm 13 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 13 X 15 MM, FPBGA-165 165 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67902S80PFI8
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8 ns 100 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 230 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e0 3 85 °C -40 °C 225 20 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES Tin/Lead (Sn85Pb15) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 100 not_compliant 3A991.B.2.A 8542.32.00.41
IDT71V67902S85BGI
 Integrated Device Technology Inc 		Check for Price No Obsolete 9.4372 Mbit 18 512KX18 3.3 V 8.5 ns 87 MHz CACHE SRAM FLOW-THROUGH ARCHITECTURE COMMON 1 512000 524.288 k SYNCHRONOUS 3-STATE PARALLEL 70 mA 3.14 V 210 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PBGA-B119 Not Qualified e0 3 85 °C -40 °C 225 20 119 PLASTIC/EPOXY BGA BGA119,7X17,50 RECTANGULAR GRID ARRAY YES TIN LEAD BALL 1.27 mm BOTTOM 2.36 mm 22 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC BGA 14 X 22 MM, PLASTIC, BGA-119 119 not_compliant 3A991.B.2.A 8542.32.00.41
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