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MPC5534MVM80
NXP Semiconductors
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$19.4301 | Yes | Not Recommended | 32 | 80 MHz | 1048576 | 65536 | 40 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | YES | NO | YES | 8 | YES | FLASH | 250 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B208 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 208 | PLASTIC/EPOXY | BGA | BGA208,16X16,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2 mm | 17 mm | 17 mm | NXP SEMICONDUCTORS | 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MO-151AAF-1, MAPBGA-208 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||
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MPC5553MZQ132
NXP Semiconductors
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$35.0213 | No | Not Recommended | 32 | 132 MHz | 1572864 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 510 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B324 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 324 | PLASTIC/EPOXY | BGA | BGA324,22X22,40 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 23 mm | 23 mm | NXP SEMICONDUCTORS | 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||
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MPC5554MZP132
NXP Semiconductors
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$51.8955 | No | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||
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MPC5553MZP132
NXP Semiconductors
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$55.9050 | No | End Of Life | 32 | 132 MHz | 1572864 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 510 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | BGA | BGA416,26X26,40 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||
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MPC5554MZP132R2
NXP Semiconductors
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$67.9455 | No | Not Recommended | 32 | 132 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||
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MPC5554MZP80
NXP Semiconductors
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$71.1700 | No | Not Recommended | 32 | 80 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||
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MPC5554MZP112
NXP Semiconductors
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$72.4600 | No | Not Recommended | 32 | 112 MHz | 2097152 | 65536 | 32 | 24 | 20 MHz | 220 | YES | 1.5 V | MICROCONTROLLER | CMOS | IT ALSO REQUIRES 3.3V SUPPLY | NO | NO | YES | 8 | YES | FLASH | 600 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 245 | 30 | 416 | PLASTIC/EPOXY | HBGA | BGA416,26X26,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEPBGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||
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MPC5566MZP144
NXP Semiconductors
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$73.9865 | No | Active | 32 | 144 MHz | 3145728 | 131072 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | YES | YES | 8 | YES | FLASH | 820 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e0 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | BGA | BGA416,26X26,40 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||
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MPC555LFCZP40
NXP Semiconductors
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$87.3893 | No | Obsolete | 32 | 40 MHz | 458752 | 26624 | MPC500 | 32 | 24 | 20 MHz | 101 | 3 | YES | 3.3 V | MICROCONTROLLER, RISC | HCMOS | ALSO REQUIRES 5V SUPPLY | YES | NO | NO | FLOATING POINT | YES | YES | 4 | 8 | 8 | YES | FLASH | 3.6 V | 3.3 V | INDUSTRIAL | S-PBGA-B272 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 235 | 30 | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 | unknown | 3A991.A.2 | 8542.31.00.01 | NXP | 1997-09-16 | |||
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MPC5566MVR132
NXP Semiconductors
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$91.4349 | Yes | Active | 32 | 132 MHz | 3145728 | 131072 | 32 | 24 | 20 MHz | 256 | YES | 1.5 V | MICROCONTROLLER, RISC | CMOS | ALSO REQUIRES 3.3V SUPPLY | NO | YES | YES | 8 | YES | FLASH | 820 mA | 1.65 V | 1.35 V | AUTOMOTIVE | S-PBGA-B416 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 416 | PLASTIC/EPOXY | BGA | BGA416,26X26,40 | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP |