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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: PC755CMPH366LE under Microprocessors

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	Part Number

Teledyne HiRel

		Most Relevant							Technical									Compliance	Operating Conditions		Physical								Dimensions			Other
Composite Price	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Package Description	ECCN Code	HTS Code

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Obsolete

32

366 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.1 V

1.8 V

MILITARY

S-CBGA-B360

125 °C

-55 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

25 mm

BGA-360

3A991.a.2

8542.31.00.25

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Teledyne HiRel

Check for Price

Obsolete

32

366 MHz

64

32

100 MHz

YES

2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

2.1 V

1.8 V

MILITARY

S-CBGA-B360

125 °C

-55 °C

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

25 mm

BGA-360

3A991.a.2

8542.31.00.25