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MAX5852ETL+
Maxim Integrated Products
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$9.1038 | Yes | Yes | Transferred | 3 V | 1.25 V | -1 V | 0.0977 % | 8 | YES | D/A CONVERTER | COMPLEMENTARY BINARY | PARALLEL, 8 BITS | 2 | 12 ns | CMOS | INDUSTRIAL | S-XQCC-N40 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 6 X 6 MM, 0.8 MM HEIGHT, MO-220-WJJD-2, TQFN-40 | 40 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX5852ETL
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 1.25 V | -1 V | 0.0977 % | 8 | YES | D/A CONVERTER | COMPLEMENTARY BINARY | PARALLEL, 8 BITS | 2 | 12 ns | CMOS | INDUSTRIAL | S-XQCC-N40 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 40 | UNSPECIFIED | HVQCCN | LCC40,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 6 X 6 MM, 0.8 MM HEIGHT, MO-220-WJJD-2, TQFN-40 | 40 | not_compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX5852ETL-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 1.25 V | -1 V | 0.0977 % | 8 | YES | D/A CONVERTER | COMPLEMENTARY BINARY | PARALLEL, 8 BITS | 2 | 12 ns | CMOS | INDUSTRIAL | S-XQCC-N40 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 40 | compliant | 8542.39.00.01 | ||||||||||
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MAX5852ETL
Rochester Electronics LLC
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Check for Price | No | Active | 3 V | 1.25 V | -1 V | 0.0977 % | 8 | YES | D/A CONVERTER | COMPLEMENTARY BINARY | PARALLEL, 8 BITS | 2 | 12 ns | CMOS | INDUSTRIAL | S-XQCC-N40 | COMMERCIAL | e0 | 1 | 85 °C | -40 °C | 245 | NOT SPECIFIED | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | ROCHESTER ELECTRONICS LLC | QFN | 6 X 6 MM, 0.8 MM HEIGHT, MO-220-WJJD-2, TQFN-40 | 40 | unknown | |||||||||
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MAX5852ETL+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 1.25 V | -1 V | 0.0977 % | 8 | YES | D/A CONVERTER | COMPLEMENTARY BINARY | PARALLEL, 8 BITS | 2 | 12 ns | CMOS | INDUSTRIAL | S-XQCC-N40 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 40 | compliant | 8542.39.00.01 | |||||||||
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MAX5852ETL+
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 1.25 V | -1 V | 0.0977 % | 8 | YES | D/A CONVERTER | COMPLEMENTARY BINARY | PARALLEL, 8 BITS | 2 | 12 ns | CMOS | INDUSTRIAL | S-XQCC-N40 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 40 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | ANALOG DEVICES INC | 40-LFCSP-6X6X0.75 | 6 X 6 MM, 0.8 MM HEIGHT, MO-220-WJJD-2, TQFN-40 | 40 | compliant | 40-LFCSP-6X6X0.75 | 2004-04-21 | Analog Devices |