Part Details for AS4C32M16D2-25BCN by Alliance Memory Inc
Overview of AS4C32M16D2-25BCN by Alliance Memory Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for AS4C32M16D2-25BCN
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
913-AS4C32M16D225BCN
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Mouser Electronics | DRAM 512M, 1.8V, 32M x 16 DDR2 RoHS: Compliant | 0 |
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Order Now | |
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Karl Kruse GmbH & Co KG | DDR2 512Mb 32M x 16 1.8V 84-ball BGA 400 MHz Commercial Temp | 3365 |
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RFQ | |
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Chip1Cloud | IC DRAM 512M PARALLEL 84FBGA | 1580 |
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RFQ |
Part Details for AS4C32M16D2-25BCN
AS4C32M16D2-25BCN CAD Models
AS4C32M16D2-25BCN Part Data Attributes:
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AS4C32M16D2-25BCN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C32M16D2-25BCN
Alliance Memory Inc
DDR DRAM, 32MX16, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-84
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | 8 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-84 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | FOUR BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 mm |
Alternate Parts for AS4C32M16D2-25BCN
This table gives cross-reference parts and alternative options found for AS4C32M16D2-25BCN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS4C32M16D2-25BCN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS4C32M16D2-25BIN | DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-84 | Alliance Memory Inc | AS4C32M16D2-25BCN vs AS4C32M16D2-25BIN |