AK93C57
vs
WF-128K32-200HM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ASAHI KASEI MICRODEVICES CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Package Description |
DIP, DIP8,.3
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Data Retention Time-Min |
10
|
|
| Endurance |
10000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDIP-T8
|
S-XPGA-P66
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
2048 bit
|
4194304 bit
|
| Memory IC Type |
EEPROM
|
FLASH MODULE
|
| Memory Width |
16
|
32
|
| Number of Terminals |
8
|
66
|
| Number of Words |
128 words
|
131072 words
|
| Number of Words Code |
128
|
128000
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
128X16
|
128KX32
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
PGA
|
| Package Equivalence Code |
DIP8,.3
|
PGA66,11X11
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
GRID ARRAY
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Serial Bus Type |
MICROWIRE
|
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.005 mA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
PERPENDICULAR
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
2
|
1
|
| Access Time-Max |
|
200 ns
|
| Data Polling |
|
NO
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Toggle Bit |
|
NO
|
| Type |
|
NOR TYPE
|
|
|
|
Compare AK93C57 with alternatives
Compare WF-128K32-200HM with alternatives