AT24C02CU3-CUM-T vs IS24C02A-2SI feature comparison

AT24C02CU3-CUM-T Microchip Technology Inc

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IS24C02A-2SI Integrated Silicon Solution Inc

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Source Content uid AT24C02CU3-CUM-T
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTEGRATED SILICON SOLUTION INC
Package Description 2 X 1.50 MM, 0.50 MM PITCH, GREEN, VFBGA-8 0.120 INCH, LEAD FREE, PLASTIC, MO-187, MSOP-8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature 100 YEAR DATA RETENTION
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
Data Retention Time-Min 100 100
JESD-30 Code R-PBGA-B8 S-PDSO-G8
JESD-609 Code e3 e0
Length 2 mm 3 mm
Memory Density 2097152 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 262144 words 256 words
Number of Words Code 256000 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX8 256X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.85 mm 1.1 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.7 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Width 1.5 mm 3 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1
Rohs Code No
Part Package Code TSSOP
Pin Count 8
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR
Package Equivalence Code TSSOP8,.19
Power Supplies 2/5 V
Standby Current-Max 0.000001 A
Supply Current-Max 0.003 mA
Supply Voltage-Nom (Vsup) 2.5 V
Write Protection HARDWARE

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