CLC115MDC
vs
CLC114AJ-QML
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIE,
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
20 µA
|
|
| Bandwidth (3dB)-Nom |
700 MHz
|
200 MHz
|
| Input Offset Voltage-Max |
9000 µV
|
8200 µV
|
| JESD-30 Code |
R-XUUC-N11
|
R-GDIP-T14
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
11
|
14
|
| Output Current-Min |
0.048 A
|
0.025 A
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
2700 V/us
|
450 V/us
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Bias Current-Max (IIB) @25C |
|
5 µA
|
| JESD-609 Code |
|
e0
|
| Length |
|
19.43 mm
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Equivalence Code |
|
DIP14,.3
|
| Screening Level |
|
MIL-STD-883
|
| Seated Height-Max |
|
5.08 mm
|
| Slew Rate-Min |
|
180 V/us
|
| Supply Current-Max |
|
17 mA
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare CLC115MDC with alternatives
Compare CLC114AJ-QML with alternatives