DAC8565IBPW
vs
DAC8564ICPW
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Pin Count |
16
|
16
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.40
|
8542.39.00.40
|
| Analog Output Voltage-Max |
2.5025 V
|
2.5005 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A Converter
|
D/A Converter
|
| Input Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY
|
| Input Format |
Serial
|
Serial
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 Mm
|
5 Mm
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0183%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Small Outline, Thin Profile, Shrink Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
0.2 Mhz
|
0.2 Mhz
|
| Seated Height-Max |
1.2 Mm
|
1.2 Mm
|
| Settling Time-Max |
10 µS
|
10 µS
|
| Settling Time-Nom (tstl) |
8 µS
|
8 µS
|
| Supply Current-Max |
1.5 Ma
|
1.5 Ma
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.65 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 Mm
|
4.4 Mm
|
| Base Number Matches |
1
|
1
|
|
|
|