LUPXA255A0C400
vs
IBM25PPC750CXEFP10-3T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
INTEL CORP
|
IBM MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA256,16X16,40
|
HLBGA,
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
32
|
| Bit Size |
32
|
64
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
3.6864 MHz
|
133 MHz
|
| External Data Bus Width |
32
|
64
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
24.13 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
HLBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
1.539 mm
|
| Speed |
400 MHz
|
600 MHz
|
| Supply Voltage-Max |
1.43 V
|
1.9 V
|
| Supply Voltage-Min |
1.235 V
|
1.7 V
|
| Supply Voltage-Nom |
1.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
17 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.A.2
|
|
|
|
Compare LUPXA255A0C400 with alternatives
Compare IBM25PPC750CXEFP10-3T with alternatives