M38510/65005BCA vs HD74HC132RPEL feature comparison

M38510/65005BCA QP Semiconductor

Buy Now

HD74HC132RPEL Renesas Electronics Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 215.8
CO2e (mg) 20219.441 2675.92
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 125 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns
Schmitt Trigger YES
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 3.95 mm

Compare M38510/65005BCA with alternatives

Compare HD74HC132RPEL with alternatives